Abstract:Gate oxide breakdown (OBD) is a key factor limiting the useful lifetime of an integrated circuit. Unfortunately, the conventional approach for full chip OBD reliability analysis assumes a uniform oxide thickness and worst-case temperature for all devices. In practice, however, gate oxide thickness varies from die-to-die and within-die and hence may cause different reliability for different devices even chips. Moreover, due to the increased across-die temperature variation, such difference may be exacerbated. Thus, as the precision of variation control worsens, an alternative reliability analysis approach is needed. In this paper, we propose a statistical framework for chip-level gate OBD reliability analysis while considering both die-to-die and within-die components of thickness variations as well as the across-die temperature variation. The thickness of each device is modeled as a distinct random variable and thus the full chip reliability estimation problem is defined on a huge sample space of several million devices. We observe that the chip-level OBD reliability function is independent of the relative location of the individual devices. This enables us to transform the problem such that the resulting representation can be expressed in terms of much fewer random variables. Using this transformation, we present a computationally efficient and accurate approach for estimating the full chip reliability while considering spatial correlations of gate oxide thickness as well as temperature variation. We show that, compared to Monte Carlo simulation, the proposed method incurs an error of only around 1% while improving the runtime by more than three orders of magnitude.

Application of DOE in Reliability Analysis of Experimental Devices

A Statistical Framework for Post-Fabrication Oxide Breakdown Reliability Prediction and Management

Optimization of the Performance of an Experimental Teaching Measurement System Using the Response Surface Methodology

Sensor-Driven Reliability and Wearout Management

Process Variation and Temperature-Aware Full Chip Oxide Breakdown Reliability Analysis.

Application of MSA in Quality Evaluation of Experimental Devices

Application of Orthogonal Defect Classification for Software Reliability Analysis

Interval Analysis and DEMATEL-Based Reliability Apportionment for Energy Consumption Optimization with Energy Internet.

An Overview and Application of DOE for Guided Weapon Performance Evaluation

Collaborative Reliability Analysis under the Environment of Multidisciplinary Design Optimization.

Collaborative Reliability Analysis under the Environment of Multidisciplinary Design Optimization

Statistical Analysis of Reliability for Maintenance Records

Low Carbon-Oriented Optimal Reliability Design With Interval Product Failure Analysis And Grey Correlation Analysis

Application of SPC in Quality Control of Laboratory Equipment

Designing the design of experiments (DOE) – An investigation on the influence of different factorial designs on the characterization of complex systems

Environmental-friendly Reliability Allocation for Product Platform Based on Expert Measurement and ICN

A new Kriging-based DoE strategy and its application to structural reliability analysis

Analysis of the Relationship Between Computer DISLab Device and College Physics Experiment Teaching

Reliability Analysis of Digital Signal Generator

A deducing-based reliability optimization for electrical equipment with constant failure rate components duration their mission profile

Reliability-based Optimization of Maintenance Scheduling of Mechanical Components with the Method of Accelerated Tests