Laminated Al2O3/Al composites bonded by epoxy resin adhesive

Weixin Li,Ying Lu,MingGui Xie,HaoDong Yin,Pinggen Rao
DOI: https://doi.org/10.3969/j.issn.1000-565X.2013.02.019
2013-01-01
Abstract:Laminated Al2O3/Al ceramic composites were successfully fabricated via a simple molding process at room temperature and 5 MPa, with epoxy resin adhesives as the binder. Then, the bond strengths of the adhesives with various mass ratios of epoxy resin to hardener, namely 1:0.7, 1:0.8, 1:0.9 and 1:1.0, were investigated. The results indicate that the bond strength reaches its maximum when the mass ratio is 1:0.8, and that, when Al foils with their surface ground in different directions are added in the lap joints, the unidirectional grinding may result in higher bond strength. Microstructure analysis results show that the interfaces of Al2O3/epoxy/Al bond tightly. Moreover, mechanical test results show that, as compared with Al2O3 monolith, the fabricated composites have a slightly lower bending strength but much higher fracture toughness and fracture work, which is attributed to the multiple fractures occurring during the crack propagation.
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