Abstract:Co-4.0 at.% P and Co-8.0 at.% P metallization layers with a thickness of 3.5 µm were electroplated on printed circuit boards as surface finishes. Ball grid array Sn-3.0Ag-0.5Cu (SAC305) solder balls were connected with Co-P metallization by reflow, and solid-state interfacial reaction in the solder joints aged at 110 and 150°C up to 1000 h was systematically investigated. CoSn3 and (Cu,Co) <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</inf> Sn <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">y</inf> interfacial intermetallic compounds (IMCs) were observed at the interface of SAC/Co-4.0P joints, while Co-Sn-P IMC was found at the interface of SAC/Co-8.0P joints. The growth of three IMCs was all governed by diffusion-controlled mechanism according to the analysis on kinetics. The growth coefficients K of the combination of CoSn <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> and (Cu,Co) <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</inf> Sn <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">y</inf> were 1.23×10 −19 and 24.03×10 −19 m 2 /s at 110 and 150°C, respectively, while the K values of Co-Sn-P IMC were 0.75×10 −19 and 2.42×10 −19 m 2 /s at 110 and 150°C, respectively. For comparison, SAC/Cu joints were prepared and analyzed, and the K values of the combination of Cu <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</inf> Sn <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</inf> and Cu <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> Sn interfacial IMCs were 19.88×10 −19 and 76.18×10 −19 m 2 /s at 110 and 150°C, respectively. Therefore, the Co-Sn-P IMC in SAC/Co-8.0P joints had the smallest growth rate. The activation energy E <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">a</inf> for CoSn <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> plus (Cu,Co) <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</inf> Sn <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">y</inf> and Co-Sn-P was calculated to be 100.2 and 39.5 kJ/mol, respectively. In addition, the shear strength of SAC/Co-P and SAC/Cu joints was measured. SAC/Co-8.0P joints had the largest shear strength after being annealed at 150°C, which was about 20% larger than that of SAC/Cu joints. In summary, electroplated Co-P film with an optimal composition is a promising candidate for metallization used in lead-free soldering.

The interfacial reaction between Sn–Ag alloys and Co substrate

Interfacial Reactions in Sn-Ag/Co Couples

Interfacial Reactions in Sn/Ni-xW Couples

Sn/Co solid/solid interfacial reactions

Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

Microstructure and morphology of interfacial intermetallic compound CoSn 3 in Sn–Pb/Co–P solder joints

Synthesis and Atomic Transport of CoSn3 NanoIMC by In Situ TEM

Interfacial reactions in the Sn–Sb/Ag and Sn–Sb/Cu couples

Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures

Co/(Ag-41.0at.%Sb)(1-X)Co-X And Ni/(Ag-41.0at.%Sb)(1-X)Ni-X Interfacial Reactions

Interfacial reactions in Ag-Sn/Cu couples

Reactive diffusion at the interface between Cu and Sn–Ag alloys

Interfacial reactions in the Sn–In–Zn/Ag and Sn–In–Zn/Ni couples

Interfacial Reactions in Sn–20In–2.8Ag/Cu Couples

Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization

Interfacial Reactions in the Sn–20 At.% In/Cu and Sn–20 At.% In/Ni Couples at 160 °C

Co alloying and size effects on solidification and interfacial reactions in the Sn−Zn−(Co)/Cu couples

Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints

Co/(Ag-41.0 At.%sb)1−xcox and Ni/(Ag-41.0 At.%sb)1−xnix Interfacial Reactions

Interfacial Reactions in the Sn-Ag/Au Couples

Interfacial Reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) Systems