Study on adaptive control of chemical mechanical polishing transfer robot grabbing wafer

Zhao Jianwei,Lu Xinchun,He Yongyong
DOI: https://doi.org/10.13245/j.hust.2012.s2.014
2012-01-01
Abstract:An adaptive control method of robot wafer grabbing was proposed for chemical mechanical polishing equipment,when the station of wafer was changed in the equipment.The hand of the robot adjusted real-timely the wafer grabbed position through measuring the error of wafer station using advanced infrared sensor,when the robot grabbed the wafer.The adaptive control made the robot′s hands grab wafer real-timely.Therefore,the efficiency and the ability of robot were improved.Simulation results prove the validity of the proposed control method.
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