Intrinsically Thermal Conductive Polymers: Heat Conduction Mechanism, Structure & Performances and Applications
Wenying Zhou,Fang Wang,Yating Yang,Yun Wang,Yingying Zhao,Liangqing Zhang
DOI: https://doi.org/10.7536/pc221102
2023-01-01
Progress in chemistry
Abstract:Heat dissipation has emerged as a critical challenge and technical bottleneck which is increasingly restricting the continuous miniaturization of large-power and ultrahigh frequency microelectronic devices and high-voltage electrical insulation equipment. High-performance heat conductive materials are highly desirable for effective thermal management. Compared with conventional heat conductive polymeric composites, the intrinsically thermal conductive polymers have gained extensive research and attention from domestic and overseas owing to their integrated excellent overall properties like high thermal conductivity and high dielectric breakdown strength, excellent flexibility, lightweight and high strength, etc. The present paper first discusses the heat conduction mechanisms in intrinsic polymers, and then systematically analyzes and reviews the following factors influencing phonon transport and polymers' thermal conductivity: the structures from monomers and molecular chains with diverse scales, crystallinity, orientation, inter-chain interactions, crosslinking, structure defects, as well as temperature, pressure, environmental factors, etc. Further, the strategies to prepare high thermal conductivity polymers have been summarized. Finally, this paper sums up the existing questions and challenges ahead in the study of thermal conductive polymers, and points out their future research direction and prospects potential important applications in various industrial occasions.