Micro-tensile bond strength of self-etching resin cement ResiCem to dentin

XUAN Gui-hong,FU Bai-ping
DOI: https://doi.org/10.13591/j.cnki.kqyx.2011.04.010
2011-01-01
Abstract:Objectives The aim of this study was to investigate the micro-tensile bond strength(TBS) of self-etching resin cement ResiCem to dentin with or without acid etching.Methods Fifteen non-carious adults′ third molars were used in the study.The crowns were cut into two perpendicularly to tooth long axis at the middle one third of crowns in order to expose the dentin surfaces of both sectioned sides.Before cementation,dentin surfaces in the Resin Cem group were acid etched for 0 s,5 s,10 s,or 15 s,respectively.The sectioned dentin surfaces were cemented with ResiCem and Panavia F separately for comparison.After 24 hours,water storage,all specimens were perpendicularly sectioned through the resin-dentin interfaces with a low-speed saw(Isomet) under water cooling.Finally,all the specimens were prepared into beams at about 1mm×1mm×8mm.Micro-tensile bond strength was tested.The resin-dentin interfaces were observed with scanning electron microscope(SEM).Results There was no significant difference of TBS to dentin between ResiCem [(16.9±5.3) MPa] and Panavia F [(17.0±5.2) MPa)](P>0.05).However,acid etching markedly reduced the dentin bond strength of ResiCem with acid etching time extending(P<0.05).Conclusions ResiCem possessed a similar dentin bond strength to Panavia F.Acid etching had detrimental effects on ResiCem bonding to dentin.
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