Abstract:We consider the effects of inhomogeneous grain boundary (GB) diffusivity on the formation of crack-like grain boundary diffusion wedges and evolution of compressive stress during the growth of a polycrystalline thin film on a substrate with a perfectly bonded film-substrate interface. The problem is formulated as a class of moving boundary diffusion problems with fully coupled elasticity, GB diffusion and film growth. The inhomogeneous GB mobility leads to a set of hypersingular integro-differential equations which are solved by a special numerical scheme. During the film growth, atoms diffuse into the GBs due to the tensile coalescence stress in the film associated with GB formation. We show that, at deposition rates comparable to the diffusion time scale, such GB diffusion leads to temporal decay of GB traction and induces crack-like singular stress concentration at the roots of the GBs. For a slowly growing high mobility thin film, the stress intensity factor near the tip of the diffusion wedge is comparable to that of a GB diffusion wedge under annealing conditions and can lead to nucleation of dislocations, which in turn can influence stress evolution during film growth. Furthermore, the higher chemical potential at the film surface can overdrive adatoms into GBs and result in a final compressive stress in the film. Our simulations on cyclic film deposition and growth interruption processes qualitatively reproduced the experimentally observed behavior of GB mobility on the Stress-Thickness evolution during deposition, the stress relaxation during growth interruption, as well as the dependence of steady state stress on the deposition rate.

Observation and Model of Highly Ordered Wavy Cracks Due to Coupling of In-Plane Stress and Interface Debonding in Silica Thin Films

Formation of Wavy Crack Morphology in Silicon Oxide Films Due to Collaborative Interface Debonding

In-situ observation of crack propagation through the nucleation of nanoscale voids in ultra-thin, freestanding Ag films

In situ observation of intergranular fracture propagation in nanocrystalline freestanding ultrathin tungsten film

An analytical method for assessing the initiation and interaction of cracks in fused silica subjected to contact sliding

Diffusive crack-grain interplay in freestanding nanocrystalline silver thin film

Formation Mechanism of Radial and Circular Cracks Promoted by Delamination in Drying Silica Colloidal Deposits

Direct observation on the surface fracture of ultrathin film double-network hydrogels

Simulation Of Near-Crack-Tip Strain Fields On Single-Crystal Silicon Wafer

Distributed fiber optic sensing for micro- and macro-crack quantification: an interfacial-fracture-energy-based model

Stress-dependent Molecular Pathways of Silica–water Reaction

Self-emitted surface corrugations in dynamic fracture of silicon single crystal

Archimedes Spiral Cracks Developed in a Nanofilm/Substrate System

Self-replicating cracks: a collaborative fracture mode in thin films

An Investigation into the Densification-Affected Deformation and Fracture in Fused Silica under Contact Sliding

Hierarchical Wrinkles and Oscillatory Cracks in Metal Films Deposited on Liquid Stripes.

Evolution of nanoscale morphology on fracture surface of brittle metallic glass

FORMATION OF CRACK-LIKE DIFFUSION WEDGES AND COMPRESSIVE STRESS EVOLUTION DURING THIN FILM GROWTH WITH INHOMOGENEOUS GRAIN BOUNDARY DIFFUSIVITY

Nanomechanical investigation of the interplay between pore morphology and crack orientation of amorphous silica

Size Dependent Morphologies of Brittle Silicon Nitride Thin Films with Combined Buckling and Cracking

Control and Manipulation of Nano Cracks Mimicking Optical Wave