Effect of solidification temperature range on the dendritic growth mode

ChongDe Cao,Fang Wang,LiBing Duan,XiaoJun Bai

DOI: https://doi.org/10.1007/s11433-010-4167-y

2010-01-01

Abstract:Electromagnetic levitation technique was used to undercool bulk samples of Co-20% Cu and Co-60% Cu alloys and high undercoolings up to 303 and 110 K were achieved, respectively. The dendritic growth velocities were measured as a function of undercooling. The dendrite growth velocity of the Co-20% Cu alloy was much higher than that of the Co-60% Cu alloy. The experimental data were analyzed on the basis of the LKT/BCT dendritic growth model by taking into account non-equilibrium interface kinetics. It has been revealed that a transition from solute diffusion controlled dendritic growth to thermal diffusion controlled dendritic growth occurs at an undercooling of about 66 K for the Co-20% Cu alloy, whereas the dendrite growth in Co-60% Cu alloy proceeds in a solute diffusion controlled mode within a large solidification temperature range, and the solutal undercooling plays a dominant role. It is thus deduced that certain distinct solidification temperature ranges may be responsible for the different solidification modes for the two alloys.