Identifying wire bond shear strength based on envelope analysis of coupled signals

FENG Wu-wei,MENG Qing-feng

2011-01-01

Abstract:The wire bond shear strength is one of important indexes of bond quality.Using electrical signals produced by an ultrasonic generator as an information carrier,a feature extraction method of ultrasonic electrical signals in bond shear strength identification was investigated.A new feature extraction method based on a subband envelope segmentation was proposed for characterizing transient ultrasonic electrical signals.The filtered subband envelopes of ultrasonic electrical signals were separated into three phases individually,namely,envelope rising phase,stable one and decay one.The waveform features were extracted from each phase of one envelope for further bond shear strength identification.To remove the irrelevant information and reduce the dimension number of original feature variables,the principal component analysis was performed for feature selection.Using the selected features as inputs,an artificial neural network(ANN) was constructed to identify the complex bond fault pattern.By analyzing experimental data with the proposed feature extraction method,the results demonstrated the effective-ness of the proposed feature extraction method and the constructed artificial neural network in identifying bond shear strength.