Domain Switching and Indentation Crack Propagating in Batio3 Single Crystal Induced by Etching
RM Wang,WY Chu,YJ Su,KW Gao,LJ Qiao
DOI: https://doi.org/10.3321/j.issn:0412-1961.2005.03.015
IF: 1.797
2005-01-01
ACTA METALLURGICA SINICA
Abstract:Etching-enhanced 90 degrees domain switching and indentation crack propagating in BaTiO3 single crystal have been investigated using poled and unpoled samples, respectively. The results show that if the poled direction [001] lies in the (100) indentation plane, etching in HCl+HF solution causes the average length of 16 indentation cracks to increase from (140+/-17)mu m to (211+/-26)mu m, i.e., 50% increment. At the same time, the 90 degrees domain switching zones surrounded by the indentation cracks increase also evidently after etching. The reason is due to chernisorption of etching molecular decreasing surface energy. If Vicker's indention is carried out in the pre-etched surface, the average crack length and the size of the domain switching zones are the same with those of etching after indentation. If the [001] poling direction is normal to the indentation plane, there is no effect of etching on the domain switching zone and crack length. For unpoled sample, etching increases the domain switching zone and the crack length from (150 +/- 21) mu m to (182 +/- 30) mu m, i.e., about 20% increment.