Fault detection of flip chip by using air-coupled ultrasound excitation

Guanglan Liao,Xuekun Zhang,Yu Long,Shi Tielin
2011-01-01
Abstract:Based on the vibration model of flip chip(FC),a fault detection principle using the change of FC natural frequency was investigated.The first 5 order vibration modes of FCs with peripheral bumping solder were analyzed using COMSOL Multiphysics software.The simulation result shows that solder bumping missing can lead to the significant change for high order natural frequencies.A fault detection method of FC was proposed based on air-coupled ultrasound excitation.By measuring the vibration velocity of FC,the first 5 frequencies of defective FCs were extracted.The measurement results agree with the simulation ones,which validates the feasibility of the defect inspection method.
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