Abstract:Due to their mechanical load-bearing and functional wave transmission, adhesively bonded joints of carbon fiber-quartz fiber composites have been widely used in the new generation of stealth aviation equipment. However, the curing defects, caused by deviations between the process environment and the setting parameters, directly affect the service performance of the joint during the curing cycle. Therefore, the thermophysical parameter evolution of adhesive films was analyzed via dynamic DSC (differential scanning calorimeter), isothermal DSC and TGA (thermal gravimetric analyzer) tests. The various prefabricating defects within the adhesive layer were used to systematically simulate the impacts of void defects on the tensile properties, and orthogonal tests were designed to clarify the effects of the curing process parameters on the joints' bonding performance. The results demonstrate that the J-116 B adhesive film starts to cure at a temperature of 160 °C and gradually forms a three-dimensional mesh-bearing structure. Furthermore, a bonding interface between the J-116 B adhesive film and the components to be connected is generated. When the curing temperature exceeds 200 °C, both the adhesive film and the resin matrix thermally degrade the molecular structure. The adhesive strength weakens with an increasing defect area ratio and number, remaining more sensitive to triangle, edge and penetration defects. By affecting the molecular structure of the adhesive film, the curing temperature has a significant impact on the bonding properties; when the curing degree is ensured, the curing pressure directly impacts the adhesive's performance by influencing the morphology, number and distribution of voids. Conversely, the heating rate and heat preservation time have minimal effects on the bonding performance.

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