Present State and Perspectives for COF(chip on film) Technology

Hao CUI,Wei HE,Bo HE,Xuandong ZHANG,Jinghao XU
DOI: https://doi.org/10.3969/j.issn.1006-6055.2006.06.005
2006-01-01
Abstract:The trend that electronic products become more diminutive and more lightsized continues.So,various flat panel display are applied widely,the LCD panel is a prominent type.the COF technology has become the primary packaging technique for driver IC of LCD by many advantages owned by it.In this paper,the structure,features,key process,applications and developing direction of COF are summarized.
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