Application of Microencapsulation Technology in Adhesives

QIAO Ji-chao,HU Xiao-ling,GUAN Ping
DOI: https://doi.org/10.3969/j.issn.1001-0017.2007.01.015
2007-01-01
Abstract:The history,structure character,preparing mechanism and method of microcapsules were reviewed.Three methods for preparing microcapsules were compared which were chemical methods,phase separation and physical methods.The application and research development of microencapsulation technology were introduced.Its application in adhesives had made great progress,especially the design of microcapsule.Nowadays various species of adhesives could be provided according to the application.With microencapsulation technology,many problems could be solved which were impossible before.The application of microencapsulation technology in adhesives was discussed.And the preparation and application of microcapsule anaerobic adhesives,microcapsule pressure sensitive adhesives and microcapsule epoxy resin adhesives were discussed in detail.The future application of microcapsules in adhesives was also presented.
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