Multiple Surface Cracks in a Piezoelectric Layer Bonded to an Elastic Substrate under Transient Electromechanical Loads

Bao-Lin Wang,Yiu-Wing Mai
DOI: https://doi.org/10.1016/j.mechmat.2006.08.009
IF: 4.137
2006-01-01
Mechanics of Materials
Abstract:Piezoelectric materials are usually bonded to elastic substrates to form so-called smart material structures that are capable of sensing and actuating in a controlled manner in response to a stimulus. Such smart structures are often operated at transient electromechanical environments. In this paper, the problem of a periodic array of surface cracks in a piezoelectric layer bonded to an elastic substrate subjected to transient electromechanical loads is studied. A system of singular integral equations is formulated in terms of the crack surface displacement and electric potential. Numerical results include the time-dependent stress and electric displacement intensity factors. Effects of crack spacing and electromechanical coupling on the crack tip field intensity factors are investigated in details. Numerical examples are given for a single piezoelectric layer and a piezoelectric layer bonded to an elastic substrate, subjected to independent mechanical and electrical impact loads. Some useful conclusions are given.
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