Effect of rapid quenching on Sb grain-boundary segregation in Cu

Chunfei Li,Masashi Watanabe,David W Ackland,David B Williams
DOI: https://doi.org/10.1016/S0167-577X(02)00985-0
IF: 3
2003-01-01
Materials Letters
Abstract:Cu–2 wt.% Sb alloys in the form of 3-mm rod and 0.10-mm-thick ribbon were prepared and the Sb grain-boundary segregation was studied by using X-ray mapping in the analytical electron microscope. The rod and ribbon were prepared by Cu mold casting and single roller melt spinning, respectively. These two methods correspond to cooling rates of 102 and 106 K/s, respectively. Despite the difference in cooling rates, Sb grain-boundary segregation was revealed in both alloys.
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