Study on Failure Mechanism and Process Control of Thermal Shock on Electromagnetic Relay
Bin XIAO,Wenying YANG,Guofu ZHAI,Guowen SHEN
DOI: https://doi.org/10.16628/j.cnki.2095-8188.2019.06.003
2019-01-01
Abstract:The thermal shock test requires 20 to 50 cycles in the system test process,while the electromagnetic relay general specification requires only 5 cycles, the differences lead to the relay often failure during the test of thermal shock in the system. Electron microscopy scanning and fault tree analysis were used to analyze the causes of failure of relays after thermal shock test, and the conclusion is that the surface roughness of gold plated contacts and the contact pressure of closed contacts are the cause of this problem. In order to effectively control the adhesion of gold plated contacts, this paper analyzes the difference between domestic and foreign gold plated contacts,and verifies the optimized and improved gold plated contact surface treatment process. The design of the pressure related parameters of the closed contact was carried out by DOE experiment method. The reasonable contact surface treatment process and the control method of closed contact pressure were obtained. The results show that the use of SMAT and vibration pulse plating method can improve the relay contact surface roughness, reduce the adhesion of gold plated contact during the test of thermal shock,at the same time, it can find out the reasonable control parameters,which can ultimately improve the relay thermal shock performance and product quality.