Thermal Analysis of White LED Projector Lamp Assembling Structure

韩磊磊,王春青,田艳红
DOI: https://doi.org/10.3969/j.issn.1001-3474.2008.05.002
2008-01-01
Abstract:High-Power LED device which has high heat flux,could have high junction temperature due to inefficient heat dissipating structure,hence,low reliability and other problems occur.By using finite element analysis,a method using copper heat spreader with indent in order to enhance heat spreading has been investigated,and key components in the heat dissipating channel have been analyzed in detail.
What problem does this paper attempt to address?