Abstract:With the continuous improvement of power density of electronic device packaging, microchannel structure based on advanced packaging integration technology has become one of the hot topics in thermal management research. In this paper, two heat sink models are numerically simulated: rectangular microchannel and microchannel-pinfin hybrid. The effects of microchannel structure, inlet/outlet arrangement and pinfin design on heat sink performance were studied. The heat sink performance is evaluated by the maximum temperature at hotspot area, the total thermal resistance and the mean absolute temperature deviation (MATD). The research results show that at the same Reynolds number, the hybrid structure with pinfin has better heat sink performance. Compared with the rectangular microchannel structure, the maximum temperature at the hotspot area is reduced by 20.45 K and the total thermal resistance is reduced by 5.9 %. Compared with the three inlet/outlet arrangements of I-type, U-type and Z-type, the I-type hybrid structure has the best heat sink performance. The average absolute temperature deviation is about 10 K at high Reynolds number, and the temperature distribution is more uniform. In addition, the heat sink performance is improved by increasing the pinfin size to expand the heat transfer area. This paper uses simulation results to build an artificial neural network model in order to quickly and accurately predict numerical results under different parameter conditions. The network model has good accuracy and robustness, with a mean absolute error of 0.376 %. The prediction model takes heat source power, Reynolds number and pinfin structural parameters as input. Rapidly predicting the performance of heat sinks with different structural parameters under different boundary conditions will effectively save experimental and computational costs. This research provides new ideas and tools for optimizing heat sink design, and helps improve the application of microchannel cooling technology in electronic devices.

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