The thermal stability and degradation mechanism of Cu/Mo nanomultilayers

Jeyun Yeom,Giacomo Lorenzin,Lea Ghisalberti,Claudia Cancellieri,Jolanta Janczak-Rusch
DOI: https://doi.org/10.1080/14686996.2024.2357536
IF: 7.821
2024-06-08
Science and Technology of Advanced Materials
Abstract:The microstructural evolution of Cu/Mo nanomultilayers upon annealing was investigated by X-ray diffraction and transmission electron microscopy. The isothermal annealing process in the temperature ranges of 300–850°C was conducted to understand the thermal behavior of the sample and follow the transformation into a nanocomposite. Annealing at 600°C led to the initiation of grain grooving in the investigated nanomultilayer, and it degraded into a spheroidized nanocomposite structure at 800°C. The sample kept the as-deposited Cu {111}//Mo{110} fiber texture up to 850°C. The residual stress was investigated to explain microstructure changes. The activation energy of degradation kinetics of Cu/Mo nanomultilayers was determined to understand the rate-determining mechanism for the degradation of nanolaminate structures. This study investigates the microstructural evolution of Cu/Mo nanomultilayers during vacuum annealing up to 85°C and provides important insights into their thermal stability and degradation mechanisms for development and application.
materials science, multidisciplinary
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