Investigating a Machine Learning Approach to Predicting White Pixel Defects in Wafers—A Case Study of Wafer Fabrication Plant F

Dong-Her Shih,Cheng-Yu Yang,Ting-Wei Wu,Ming-Hung Shih

DOI: https://doi.org/10.3390/s24103144

IF: 3.9

2024-05-16

Sensors

Abstract:CMOS image sensor (CIS) semiconductor products are integral to mobile phones and photographic devices, necessitating ongoing enhancements in efficiency and quality for superior photographic outcomes. The presence of white pixels serves as a crucial metric for assessing CIS product performance, primarily arising from metal impurity contamination during the wafer production process or from defects introduced by the grinding blade process. While immediately addressing metal impurity contamination during production presents challenges, refining the handling of defects attributed to grinding blade processing can notably mitigate white pixel issues in CIS products. This study zeroes in on silicon wafer manufacturers in Taiwan, analyzing white pixel defects reported by customers and leveraging machine learning to pinpoint and predict key factors leading to white pixel defects from grinding blade operations. Such pioneering practical studies are rare. The findings reveal that the classification and regression tree (CART) and random forest (RF) models deliver the most accurate predictions (95.18%) of white pixel defects caused by grinding blade operations in a default parameter setting. The analysis further elucidates critical factors like grinding load and torque, vital for the genesis of white pixel defects. The insights garnered from this study aim to arm operators with proactive measures to diminish the potential for customer complaints.

engineering, electrical & electronic,instruments & instrumentation,chemistry, analytical

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the white - pixel defect problem that occurs in the semiconductor manufacturing process, especially in wafer manufacturing. White - pixel defects are mainly caused by metal impurity contamination or defects in the grinding blade process, and these defects will affect the performance of CMOS image sensor (CIS) products. Although it is challenging to immediately reduce metal impurity contamination during the production process, the white - pixel problem in CIS products can be significantly alleviated by improving the defects in the grinding blade treatment process. Therefore, this paper focuses on a silicon wafer manufacturer in Taiwan, using machine - learning techniques to analyze white - pixel defects reported by customers and predict the key factors causing these defects. Specifically, the study adopts the Classification and Regression Tree (CART) and Random Forest (RF) models to predict white - pixel defects caused by grinding blade operations. These two models can achieve a prediction accuracy rate of 95.18% under the default parameter settings. In addition, the study also reveals the influence of key factors such as grinding load and torque on white - pixel defects. Through these insights, the study aims to provide preventive measures for operators to reduce potential customer complaints.

Investigating a Machine Learning Approach to Predicting White Pixel Defects in Wafers—A Case Study of Wafer Fabrication Plant F

Machine Learning Based Wafer Defect Detection

Machine Learning-Based Detection Method for Wafer Test Induced Defects

Detection and Prediction of Chipping in Wafer Grinding Based on Dicing Signal

Inspection and Classification of Semiconductor Wafer Surface Defects Using CNN Deep Learning Networks

A Data-Driven Approach for Identifying Possible Manufacturing Processes and Production Parameters That Cause Product Defects: A Thin-Film Filter Company Case Study

Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between Front-End-of-Line and Back-End-of-Line Processes

Deep Learning-Based Detection of Defects in Wafer Buffer Zone During Semiconductor Packaging Process

Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review

Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

A Simple Confidence-Supervised Model for High-Resolution Defect Recognition

Detection and Prediction of Probe Mark Damage in Wafer Testing

Key Parameter Identification and Defective Wafer Detection of Semiconductor Manufacturing Processes Using Image Processing Techniques

Applying the support vector machine with optimal parameter design into an automatic inspection system for classifying micro-defects on surfaces of light-emitting diode chips

Observational and Experimental Insights into Machine Learning-Based Defect Classification in Wafers

AI classification of wafer map defect patterns by using dual-channel convolutional neural network

An Automatic Detection Method for Cutting Path of Chips in Wafer

Wafer fault detection and key step identification for semiconductor manufacturing using principal component analysis, AdaBoost and decision tree

Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

Defective wafer detection using a denoising autoencoder for semiconductor manufacturing processes

Applying Data Augmentation and Mask R-CNN-Based Instance Segmentation Method for Mixed-Type Wafer Maps Defect Patterns Classification