Comparison of Different NDT Techniques for Evaluation of the Quality of PCBs Produced Using Traditional vs. Additive Manufacturing Technologies

Elena Jasiūnienė,Renaldas Raišutis,Vykintas Samaitis,Audrius Jankauskas
DOI: https://doi.org/10.3390/s24061719
IF: 3.9
2024-03-08
Sensors
Abstract:Multilayer printed circuit boards (PCBs) can be produced not only in the traditional way but also additively. Both traditional and additive manufacturing can lead to invisible defects in the internal structure of the electronic component, eventually leading to the spontaneous failure of the device. No matter what kind of technology is used for the production of PCBs, when they are used in important structures, quality control is important to ensure the reliability of the component. The nondestructive testing (NDT) of the structure of manufactured electronic components can help ensure the quality of devices. Investigations of possible changes in the structure of the product can help identify the causes of defects. Different types of manufacturing technologies can lead to diverse types of possible defects. Therefore, employing several nondestructive inspection techniques could be preferable for the inspection of electronic components. In this article, we present a comparison of various NDT techniques for the evaluation of the quality of PCBs produced using traditional and additive manufacturing technologies. The methodology for investigating the internal structure of PCBs is based on several of the most reliable and widely used technologies, namely, acoustic microscopy, active thermography, and radiography. All of the technologies investigated have their advantages and disadvantages, so if high-reliability products are to be produced, it would be advantageous to carry out tests using multiple technologies in order to detect the various types of defects and determine their parameters.
engineering, electrical & electronic,chemistry, analytical,instruments & instrumentation
What problem does this paper attempt to address?
The paper aims to address quality control issues that may arise in the traditional manufacturing and additive manufacturing processes of multilayer printed circuit boards (PCBs). Specifically, the research focuses on the invisible defects that may occur within the internal structure of PCBs under both manufacturing techniques, which could lead to spontaneous failures of the devices. To ensure the reliability of PCBs in critical applications, the paper explores the effectiveness of various non-destructive testing (NDT) techniques for PCB quality assessment, including acoustic microscopy, active thermography, and radiography. By comparing the performance of different NDT techniques in detecting PCBs produced by the two manufacturing processes, the research hopes to provide manufacturers and users with guidance on how to select the appropriate inspection methods to ensure high-quality PCB production. Additionally, the paper introduces some artificial defects to test the performance capabilities of these NDT techniques in practical applications.