Abstract:The limitations in previous dissipative particle dynamics (DPD) studies confined simulations to a narrow resin range. This study refines DPD parameter calculation methodology, extending its application to diverse polymer materials. Using a bottom-up approach with molecular dynamics (MD) simulations, we evaluated solubility parameters and bead number density governing nonbonded interactions via the Flory-Huggins parameter and covalent-bonded interactions. Two solubility parameter methods, Hildebrand and Krevelen–Hoftyzer, were compared for DPD simulations. The Hildebrand method, utilizing MD simulations, demonstrates higher consistency and broader applicability in determining solubility parameters for all DPD particles. The DPD/MD curing reaction process was examined in three epoxy systems: DGEBA/4,4′-DDS, DGEBA/MPDA and DGEBA/DETA. Calculations for curing profile, gelation point, radial distribution function and branch ratio were performed. Compared to MD data for DGEBA/4,4′-DDS, the maximum deviation in secondary reactions between epoxy and amine groups by DPD simulation with Krevelen–Hoftyzer was 14.8%, while with Hildebrand, it was 1.7%. The accuracy of DPD curing reaction in reproducing structural properties verifies its expanded application to general polymeric material simulation. The proposed curing DPD simulation, with a short run time and minimal computational resources, contributes to high-throughput screening for optimal resins and investigates mesoscopic inhomogeneous structures in large resin systems.

What problem does this paper attempt to address?

The main problem that this paper attempts to solve is that the parameter calculation methods in existing dissipative particle dynamics (DPD) research limit its application within the range of resin materials. Specifically, previous DPD research could only simulate a limited number of resin materials due to the limitations of parameter calculation methods. This paper aims to expand the application range of DPD in various polymer materials, especially for the simulation of the curing reaction process of thermosetting resins, by improving the DPD parameter calculation method. To achieve this goal, the author adopted a bottom - up approach, combining molecular dynamics (MD) simulations to evaluate the solubility parameters and bead number densities of non - bond interactions, as well as covalent bond interactions. By comparing two different solubility parameter calculation methods, Hildebrand and Krevelen - Hoftyzer, the study found that the Hildebrand method has higher consistency and broader applicability in determining the solubility parameters of all DPD particles. In addition, the paper also conducted a detailed examination of the DPD/MD curing reaction processes of three epoxy systems (DGEBA/4,4′ - DDS, DGEBA/MPDA, and DGEBA/DETA), including calculations such as curing curves, gel points, radial distribution functions, and branching ratios. The results show that, compared with MD data, the maximum deviation of DPD simulations using the Hildebrand method in secondary reactions is only 1.7%, far lower than 14.8% when using the Krevelen - Hoftyzer method. This indicates that the improved DPD simulation method can more accurately reproduce structural characteristics, verifying its extended application in general polymer material simulations. In conclusion, this research improves the accuracy of DPD simulations in capturing the curing dynamics of complex epoxy materials by optimizing the DPD parameter calculation method, while reducing the computational time and resource requirements, providing an effective tool for high - throughput screening of optimal resins and studying the mesoscopic heterogeneous structures of large - scale resin systems.

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