Abstract:UV debonding acrylate adhesive (UDAA) plays a crucial role in the semiconductor industry, where its excellent adhesion is required to ensure the stability of silicon wafers and leave no residue on the surface after UV irradiation. The necessary UV debonding is achieved through the formation of rigid networks by the reactions of all the vinyl groups in the system. Acrylate copolymers with vinyl groups are typically obtained by the grafting reaction of isocyanate with a side-chain hydroxyl comonomer. However, these grafting reactions easily fail due to early cross-link formation. In this study, we illustrate a straightforward method for preparing UDAA by conducting a postgrafting reaction after one-step mixing of isocyanate functional monomer (IPDI-H) and hydroxyl acrylate copolymers (BA-H), thereby skipping the abovementioned vinyl grafting process. The chemical structures of the synthesized IPDI-H and BA-H were confirmed using Fourier transform infrared spectroscopy (FTIR) and proton nuclear magnetic resonance (1H-NMR) analysis. Gel permeation chromatography (GPC) was employed to determine their molecular weights, while differential scanning calorimetry (DSC) was used to determine their glass transition temperatures. The postgrafting reactions successfully introduced vinyl groups onto the polyacrylate copolymer chains, resulting in high bonding strength during use and a significant decrease in peeling strength after UV irradiation. Rheological methods, including the three-interval thixotropy test (3ITT) and tack test modes, were employed to characterize a series of acrylate UV debonding adhesives. The recovery percentage of the storage modulus in the 3ITT mode indicated that a 0.6 wt% isocyanate curing agent made the UV debonding adhesives resistant to deformation. From the maximum normal force in the tack test mode, it was found that UDAA with 10 wt% PETA monomer and 30 wt% C5 tackifying resin exhibited excellent combined adhesion and debonding properties, which were further confirmed by peel strength tests. Microscope images of the wafer surfaces after removing the adhesive tapes demonstrated the excellent UV debonding properties achieved after 40 s of UV irradiation through the postgrafting reaction. The prepared UDAA has excellent properties; the peel strength can reach 15 N/25 mm before UV irradiation and can be reduced to 0.5 N/25 mm after ultraviolet irradiation. This research establishes a comprehensive method for understanding and applying UDAA in various applications.

Enhancing the Delamination Efficiency of Polyimide-Copper Bilayers with UV/Heat-Activated Foamable Adhesive: Insights and Applications

Preparation and Dielectric Properties of Polyimide Foams Containing Crosslinked Structures

Studies on Polyimide Foams Prepared from Poly(Ester-amine Salt) Precursor Powder

An Adhesion Improvement of Low-Density Polyethylene to Aluminum through Modification with Functionalized Polymers

A novel CO 2 based UV-induced peelable adhesive for wafer dicing

Study of UHMWPE Fiber Surface Modification and the Properties of UHMWPE/Epoxy Composite

Study on Preparation and Performance of Reactive Polyurethane Hot Melt Adhesives Based on a Polycarbonate Diol and a Polyester Diol

Improving the Shear and Tack Strengths of Chlorinated Poly(propylene carbonate) through Chain Extension with Polylactic Acid for Biodegradable Hot Melt Adhesives

Polyester Adhesives via One-Pot, One-Step Copolymerization of Cyclic Anhydride, Epoxide, and Lactide

Preparation of UV Debonding Acrylate Adhesives by a Postgrafting Reaction

Thermal imidization of poly(amic acid) precursors on surface-modified poly(tetrafluoroethylene) films via graft copolymerization with glycidyl methacrylate

Functional Design of Stimuli-Responsive Poly(phthalaldehyde)-based Adhesives: Depolymerization Kinetics and Mechanical Strength Management through Plasticizer Addition

Role of the Soft and Hard Segments Structure in Modifying the Performance of Acrylic Adhesives Modified by Polyurethane Macromonomers

Tuning the Interactions in Multiresponsive Complex Coacervate-Based Underwater Adhesives

Sustainable poly(imide‐imide) vitrimer based on multiple dynamic covalent bonds

Chlorosulfonated Poly(propylene Carbonate)-Based Pressure-Sensitive Adhesives with Improved Thermal Stability and Peel Strength

Development of shape-memory polymer fiber reinforced epoxy composites for debondable adhesives

Synthesis and characterization of novel high temperature structural adhesives based on nadic end capped MDA-BTDA-ODA copolyimide

Polyurethane Adhesives with Chemically Debondable Properties via Diels-Alder Bonds

Copolymerization approach of soft segment towards the adhesion improvement of polycarbonate-based thermoplastic polyurethane

Thermal Imidization of Poly(amic Acid) Precursors on Glycidyl Methacrylate (GMA) Graft-Polymerized Si(100) Surface