Peridynamic Electromechanical Modeling of Damaging and Cracking in Conductive Composites: A Stochastically Homogenized Approach

Pan Wu,Ziguang Chen
DOI: https://doi.org/10.1016/j.compstruct.2022.116528
IF: 6.3
2022-11-28
Composite Structures
Abstract:In this paper, a coupled electromechanical peridynamic model is introduced to describe damaging and cracking in conducting composites. In this model, electrical peridynamic bonds and mechanical peridynamic bonds are used to represent the interactions between material points, and the micro-scale heterogeneities are represented by changing the properties and/or distribution of the peridynamic bonds with a stochastically homogenized approach. A significant advantage of this coupled model is that the different mechanical bonds in the stochastically homogenized model are given corresponding electrical properties, and the deformation and breakage of a mechanical bond automatically change or break the corresponding electrical bond connecting the same material points. This multi-physical peridynamic model is utilized to study the electric field evolution in conductive composites during damaging and cracking under different loading configurations (including tensile test and three-point bending test). The model costs the same as a fully homogenized one but simulates the current evolution during material damaging and cracking as observed in a model using the microstructural details. The approach presented in this paper can be applied to other multi-physical problems, especially the ones with damage and fracture involved.
mechanics,materials science, composites
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