High bias stability of Hf-doping-modulated indium oxide thin-film transistors

Wenwu Li,Caifang Gao,Xifeng Li,Jiayan Yang,Jianhua Zhang,Junhao Chu

DOI: https://doi.org/10.1016/j.mee.2024.112142

IF: 2.3

2024-01-25

Microelectronic Engineering

Abstract:Device stability is one of the key parameters for transistor applications. To improve the stability of Indium oxide (In 2 O 3 ) after a long-time gate bias, a synthetic solution of hafnium chloride (HfCl 4 ) and indium nitrate (In(NO 3 ) 3 ∙xH 2 O) reagents were used to obtain 0% to 5-at.% Hf doped In 2 O 3 thin-film transistors. With the increase of Hf doping concentration, oxygen vacancies and residual hydroxyl groups continue to decrease, suppressing the carrier concentration and influencing the trap state density of In 2 O 3 . The sub-threshold slope (SS) 0.78 V·dec −1 for the undoped In 2 O 3 transistor in this work is a typical value. When the dopant dose is up to 5-at.%, SS decreases to 0.32 V·dec −1 . According to the proportional relationship between SS and the density of trap states, it shows that the density of trap states in the dielectric layer and the semiconductor/dielectric interface SS is greatly reduced after 5-at.% Hf doping. The probability of the charge being trapped is dropped as well. At the same time, under the doping of Hf, the transistor exhibits a very small threshold voltage shift. Especially at the dopant dose of 5-at.%, the transfer characteristic curve hardly shifts. This work demonstrates an In 2 O 3 transistor with high bias stability by doping method.

engineering, electrical & electronic,nanoscience & nanotechnology,optics,physics, applied