Re-stickable All-Solid-State Supercapacitor Supported by Cohesive Thermoplastic for Textile Electronics

Guilin Tang,Yan Qiao,Ling Yu,Chang Ming Li,Zhisong Lu

DOI: https://doi.org/10.1021/acsami.0c13687

2020-09-11

Abstract:The textile-based flexible electronic device has attracted considerable attention due to its excellent conformability, skin affinity, and compatibility with the clothing industry. However, the machine-washing process may damage the electronic components, further resulting in the failure of the device. Herein, parafilm, a commercially available cohesive thermoplastic, is introduced as both a substrate and encapsulating material to fabricate an all-solid-state supercapacitor, which could be tightly stuck on and easily peeled off from a fabric. The supercapacitor possesses excellent capacitive behavior (73.7 F/g at a current density of 1 A/g), long cycle life (capacitance retention &gt;90% after 5000 cycles), and great flexibility (capacitance retention &gt;98% after 100 times of bending/twisting). After water flushing and soaking, the capacitance of the supercapacitor could be retained at about 98% of its original level. A parafilm-based piezoresistive sensor with good pressure-sensing performance has also been fabricated via the same approach to demonstrate the universality of the proposed strategy for textile re-stickable electronics. This work may not only fabricate novel flexible electronic systems for wearable applications but also provide a universal strategy to address the machine-washing issues in textile electronics.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.0c13687?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.0c13687</a>.Mass change of the electrode (Figure S1); surface morphology of the electrode after deposition of active materials (Figure S2); capacitance retention rate at different bending states (Figure S3); capacitance retention of an as-prepared device (Figure S4); fabrication of a parafilm-based piezoresistive sensor (Figure S5); fabrication procedures of a parafilm-based piezoresistive sensor (Figure S6); comparison of the performance of the as-prepared sensor with those of other reported film-based pressure sensors (Figure S7); current responses of a parafilm-based piezoresistive sensor (Figure S8) (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c13687/suppl_file/am0c13687_si_001.pdf">PDF</a>)Repeated stretching of the textile along different directions (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c13687/suppl_file/am0c13687_si_002.mp4">MP4</a>)This article has not yet been cited by other publications.

materials science, multidisciplinary,nanoscience & nanotechnology