Abstract:Polyimide (PI) composite films with enhanced mechanical properties were prepared by incorporating modified fumed silica (FS) particles while preserving their optical and thermal characteristics. The PI matrix was synthesized using a fluorinated diamine, a fluorinated dianhydride, and a rigid biphenyl dianhydride via chemical imidization. Commercially available FS particles, including unmodified FS particles (0-FS) and particles modified with dimethyl (2-FS), trimethyl (3-FS), octyl (8-FS), octamethylcyclotetrasiloxane (D4-FS), and polydimethylsiloxane (PDMS-FS) were used. Scanning electron microscope images and nitrogen adsorption–desorption isotherms revealed well-defined porous structures in the FS particles. The water contact angles on the composite films increased compared to those of the pristine PI films, indicating improved water resistance. The PI/0-FS films exhibited a typical trade-off relationship between tensile modulus and elongation at break, as observed in conventional composites. Owing to the poor compatibility and agglomeration of the PDMS-FS particles, the PI/PDMS-FS composite films exhibited poor mechanical performance and diminished optical characteristics. Although the longer-chained FS particles (8- and D4-FS) improved the tensile modulus of the PI film by up to 12%, a reduction of more than 20% in toughness was observed. The PI composite films containing the methylated FS particles (2- and 3-FS) outperformed 8- and D4-FS in terms of mechanical properties, with PI/3-FS films showing an over 10% increased tensile modulus (from 4.07 to 4.42 GPa) and 15% improved toughness (from 6.97 to 8.04 MJ/m3) at 7 wt. % silica loading. Except for the PI/PDMS-FS composites, all composite film samples exhibited more than 86% transmittance at 550 nm. Regarding thermal properties, the glass transition temperature (Tg) and thermal stability remained stable for most composite films. In addition, PI/3-FS films demonstrated enhanced dimensional stability with lower coefficients of thermal expansion (from 47.3 to 34.5 ppm/°C). Overall, this study highlights the potential of incorporating specific modified FS particles to tailor the mechanical, optical, and thermal properties of PI composite films.

Phosphinated poly(imide-siloxane) hybrid films with enhanced adhesion strength and reduced dielectric constant

Enhanced performance of low-dielectric siloxane-polyimide copolymers: Synthesis and properties

Siloxane‐containing polyimide films with high heat resistance and low dielectric constant

Enhanced Mechanical and Thermal Properties of Polyimide Films Using Hydrophobic Fumed Silica Fillers

Synthesis and Properties of Ultralow Dielectric Constant Porous Polyimide Films Containing Trifluoromethyl Groups

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Synergistic Enhancement of Mechanical and Dielectric Properties in Transparent Polyimides by Regulating Hydrogen Bonding and Microbranched Cross-Linking Structure

Synthesis, Characterisation and Enhanced Properties of Polyimide/mica Hybrid Films

Preparation and properties of heat-sealable polyimide films with comparable coefficient of thermal expansion and good adhesion to copper matrix

Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma

Porous polyimide composite films containing mesoporous hollow silica nanospheres with ultralow dielectric constant and dissipation loss

Thermal imidization of fluorinated poly(amic acid) precursors on a glycidyl methacrylate graft-polymerized Si(100) surface

Fluorinated polyimide/POSS hybrid polymers with high solubility and low dielectric constant

Polyimide/mica hybrid films with low coefficient of thermal expansion and low dielectric constant

Synthesis and properties of modified thermoplastic polyimide films with good dielectric properties at high frequency and enhanced thermal stability via incorporation of rigid ester and biphenyl structural units

In-Situ Self-Encapsulated Flexible Multi-Layered Poly (imide Siloxane) Copolymer Film with Resistance to Atomic Oxygen

Polyimide/polyoxometalate copolymer thin films: synthesis, thermal and dielectric properties

Multifunctional Polyimides by Direct Silyl Ether Reaction of Pendant Hydroxy Groups: Toward Low Dielectric Constant, High Optical Transparency and Fluorescence

Fluorinated polyimide with polyhedral oligomeric silsesquioxane aggregates: Toward low dielectric constant and high toughness

Synthesis, Characterization and Properties of Sio2-Polyimide Hybrid Film

Imparting low dielectric constant and high modulus to polyimides via synergy between coupled silsesquioxanes and crown ethers