Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates

Xuanqing Fan,Yi Wang,Yuhang Li,Haoran Fu
DOI: https://doi.org/10.3390/s20185425
IF: 3.9
2020-09-22
Sensors
Abstract:Buckling stability of thin films on compliant substrates is universal and essential in stretchable electronics. The dynamic behaviors of this special system are unavoidable when the stretchable electronics are in real applications. In this paper, an analytical model is established to investigate the vibration of post-buckled thin films on a compliant substrate by accounting for the substrate as an elastic foundation. The analytical predictions of natural frequencies and vibration modes of the system are systematically investigated. The results may serve as guidance for the dynamic design of the thin film on compliant substrates to avoid resonance in the noise environment.
engineering, electrical & electronic,chemistry, analytical,instruments & instrumentation
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