Potential Mechanisms of Interstitial Atomic Enhancement and Interface Failure Behavior in Ni 3 Co/Cu Systems
Yizhe Du,Yinhui Chen,Xinyi Yuan,Peng Liu,Mujun Long,Dengfu Chen
DOI: https://doi.org/10.1016/j.apsusc.2023.157388
IF: 6.7
2023-05-02
Applied Surface Science
Abstract:The excellent interfacial bonding properties are prerequisites for the stable and efficient application of coatings, and the introduction of solute elements have significant impacts on the bonding properties of the coating/substrate. The effects of interstitial atoms (C, B, N) doping on stability, adhesion strength and mechanical properties of Ni 3 Co/Cu interface were investigated by first-principle calculation method, and the strengthening as well as failure mechanisms of the interface were clarified. The results demonstrate that the thermodynamic stability of the Ni 3 Co/Cu interface has a basically positive dependence on the adhesion strength. The introduction of interstitial atoms can enhance the adhesion strength and mechanical properties of the Ni 3 Co/Cu interface. On the other hand, the Cu-Cu atomic layer gradually expands under tensile strain, accompanied by a decrease in charge density and eventually fracture. Moreover, doping of interstitial atoms can significantly strengthen the bonding interaction between localized atoms at the interface while increasing the charge density, which is favorable for increasing the binding capacity between the corresponding atomic layers. Due to the strengthening effect described above, the deformation of the Ni 3 Co-bulk during interfacial tensile requires the expenditure of additional energy provided by strain, resulting in a higher tensile strength of the interface.
chemistry, physical,physics, applied, condensed matter,materials science, coatings & films