All-Three-Dimensionally-Printed AgPd Thick-Film Strain Gauge with a Glass-Ceramic Protective Layer for High-Temperature Applications

Yingjun Zeng,Guochun Chen,Fuxin Zhao,Lida Xu,Yanzhang Fu,Chao Wu,Chenhe Shao,Gonghan He,Qinnan Chen,Yang Zhao,Daoheng Sun,Zhenyin Hai
DOI: https://doi.org/10.1021/acsami.3c10724
IF: 9.5
2023-10-08
ACS Applied Materials & Interfaces
Abstract:A high-temperature thin/thick-film strain gauge (TFSG) shows development prospects for in situ strain monitoring of hot-end components due to their small perturbations, no damage, and fast response. Direct ink writing (DIW) 3D printing is an emerging and facile approach for the rapid fabrication of TFSG. However, TFSGs prepared based on 3D printing with both high thermal stability and low temperature coefficient of resistance (TCR) over a wide temperature range remain a great challenge. Here, we...
materials science, multidisciplinary,nanoscience & nanotechnology
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