Laser-induced fracturing: an alternative to mechanical polishing and patterning of LiNbO/sub 3/ integrated optics chips

C. Staus,R. Suess,L. Mccaughan
DOI: https://doi.org/10.1109/JLT.2004.827672
IF: 4.7
2004-05-01
Journal of Lightwave Technology
Abstract:We report a method for cutting z-oriented LiNbO/sub 3/ substrates into nearly arbitrary shapes using a pulsed UV laser to controllably fracture the crystal. The end surfaces appear optically smooth. Ti-diffused waveguides terminated using this technique have fiber-waveguide-fiber insertion losses which are equal to the lowest values reported for waveguide end faces prepared using conventional mechanical polishing techniques.
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