Chapter 14, Materials modelling and characterisation for thermo-mechanics

Yangjian Xu,L. Liang

DOI: https://doi.org/10.1109/esime.2005.1502839

Abstract:Mechanical Properties of Sintered Kovar Alloy for Structure Components of OpticalDevices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Liao K. C., Feng H.P., Cheng C. D., Tsai H.H., Shieh W B. Fracture and Delamination of Thin Multilayers on Ultra-thin Silicon . . . . . . . . . . . . . . . . G. Kravchenko, J. Bagdahn Models correlation and comparison for solder joint reliability ..................... Yangjian Xu, Lihua Liang, Yong Liu Comparison of Lifetime Predictions with 3-D Finite Element Model of Power Electronics Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . S. Moreau, R. LRroy, :I: kqueu, R. Jirisian A reliability evaluation of lead-free ball grid array (BGA) solder joints through mechanical fatigue testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C. Ryan, J. Punch, 3. Rodgers FE analysis and experimental testing of a 4-pin ceramic test vehicle with tin-lead and tin-silver-copper solder joints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M. Spraul, W. Niichter; B. Wunderle, B. Michd Measurement of acce1er;ation factor for lead-free solder (SnAg3.8CuO.7) in thermal cycling test of BGA components and calibration of lead-free solder joint model for life prediction by finite e:lement analyses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . K. Anderssan, A. Perttula, U. Salmela, J. Sarkkii, M. Tammenma Complete Model for Interfacial stresses of a WO Layered Structure . . . . . . . . . . . . . . . . . D. Sujan, M. I! K Murthy, K. N. Seetharamu, A. Y. Hassan Viscoelastic characterization of fast curing moulding compounds ................... B.V Milosheva, K.M.B. Jansen, J.H.J. Janssen, H.J.L. Bressers, L.J. Ernst Experimental Investigation of the Adhesion Dilation with Negative Thermal Expansion LiAISi206 Fillers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . H-H. Tsai, C.D. Cheng, WB. Shieh, K.Z Lee, H.P. Feng Characterization of Non-Conductive Adhesives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D. Farley, A. Dasgupi'a, J.F. J. Caers, w1 E. Hua Modelling and Experiments on an Isothermal Fatigue Test for Solder Joints .......... S. Ridout, M. Dusek, 'C. Bailey, C, Hunt Modelling Methodology for Linear Elastic Compound Modelling Versus Visco-Elastic Compounld Modelling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . R. B.R van Silfiout, J. G. J Beijer, G.Q. Zhang, W.D. van Driel 416