Abstract:Removable pressure-sensitive adhesives (PSAs) are used in the production of self-adhesive materials such as protective films, masking tapes or biomedical electrodes. This work presents a new and environmentally friendly method of obtaining this type of adhesive materials, i.e., photochemically induced free radical telomerization. Adhesive binders to removable PSAs, i.e., the photoreactive acrylic telomer syrups (ATS) were prepared from n-butyl acrylate, acrylic acid, and 4-acrylooxybenzophenone. Tetrabromomethane (CBr4) or bromotrichloromethane (CBrCl3) were used as the telogens. ATS was modified with unsaturated polybutadiene resin and a radical photoinitiator. Adhesive compositions were coated onto a carrier and UV cross-linked. The effects of the chemical nature of telomers (i.e., terminal Br or Cl atoms) and their molecular weight (K-value), as well as the cross-linking degree on adhesive properties of PSAs, were studied. It was found that with the increase in telogen content in the system, the dynamic viscosity of ATS and K-value of acrylic telomers decrease, and the conversion of monomers increases. CBr4 turned out to be a more effective chain transfer agent than CBrCl3. Moreover, telomers with terminal Br-atoms (7.5 mmol of CBr4), due to slightly lower molecular weights and viscosity, showed a higher photocrosslinking ability (which was confirmed by high cohesion results at 20 and 70 °C, i.e., >72 h). Generally, higher values of the temperature at which adhesive failure occurred were noted for PSAs based on ATS with lower telogen content (7.5 mmol), both CBr4 and CBrCl3. The excellent result for removable PSA was obtained in the case of telomer syrup Br-7.5 crosslinked with a 5 J/cm2 dose of UV-radiation (adhesion ca.1.3 N/25 mm, and cohesion > 72 h).

Effect of Photo-crosslinking on Clean Debonding of Acrylic Pressure Sensitive Adhesives from Silicon Wafer

Preparation of photo-crosslinkable acrylic copolymer and its debonding property on silicon wafer

Azide Photochemistry in Acrylic Copolymers for Ultraviolet Cross-Linkable Pressure-Sensitive Adhesives: Optimization, Debonding-on-Demand, and Chemical Modification

Surface Enrichment by Conventional and Polymerizable Sulfated Nonylphenol Ethoxylate Emulsifiers in Water-Based Pressure-Sensitive Adhesive

UV‐photopolymerized acrylic pressure‐sensitive adhesives with semi‐interpenetration structure: Effect of plasticizer structures on adhesion properties

Influence of UV Polymerization Curing Conditions on Performance of Acrylic Pressure Sensitive Adhesives

Bonding and UV debonding behaviors of acrylate pressure-sensitive adhesives by rheological methods

Preparation of UV-curable PSAs by grafting isocyanate-terminated photoreactive monomers and the effect of the functionality of grafted monomers on the debonding properties on Si wafers

Silanization as a strategy to design polyurethane-acrylic hybrid pressure-sensitive adhesives

Self-Crosslinkable Pressure-Sensitive Adhesives from Silicone-(Meth)acrylate Telomer Syrups

Effect of side group and crosslinking on the copolyesters as solvent-free pressure-sensitive adhesives

Thermally Stable UV-Curable Pressure-Sensitive Adhesives Based on Silicon-Acrylate Telomers and Selected Adhesion Promoters

Influence of Acrylic Acid on Kinetics of UV-Induced Cotelomerization Process and Properties of Obtained Pressure-Sensitive Adhesives

Isosorbide-Based Acrylic Pressure-Sensitive Adhesives Through UV-Cured Crosslinking with a Balance Between Adhesion and Cohesion

Thermal debonding pressure-sensitive adhesive blended with liquid crystal polymers

Molecular weight and crosslinking on the adhesion performance and flexibility of acrylic PSAs

Light-Activated Adhesion and Debonding of Underwater Pressure-Sensitive Adhesives

Enabling (de)bonding on Demand with Optically Switchable Pressure Sensitive Adhesive Tape Via Photodimerization

Synthesis of UV rapid curing silicone coatings via photoinitiated thiol-ene click polymerization for pressure-sensitive adhesive

Adhesion Performance and UV-Curing Behaviors of Interpenetrated Structured Pressure Sensitive Adhesives with 3-MPTS for Si-Wafer Dicing Process

Removable Pressure-Sensitive Adhesives Based on Acrylic Telomer Syrups