Human transluminally placed endovascular stented grafts: preliminary histopathologic analysis of healing grafts in aortoiliac and femoral artery occlusive disease.

M. Marin,F. Veith,J. Cynamon,L. Sanchez,C. Bakal,W. Suggs,R. Lyon,M. Schwartz,R. Parsons,K. Wengerter

DOI: https://doi.org/10.1016/S0741-5214(95)70191-5

IF: 4.86

1995-04-01

Journal of Vascular Surgery

Abstract:

What problem does this paper attempt to address?

Biomimetic Micropillar Wick for Enhanced Thin-Film Evaporation

Anand S,Chander Shekhar Sharma

DOI: https://doi.org/10.1021/acs.langmuir.3c00459

2023-02-09

Abstract:Sustainable liquid cooling solutions are recognized as the future of thermal management in the chip industry. Among them, the phase change heat transfer devices such as heat pipes and vapour chambers have shown tremendous potential. These devices rely on the physics of capillary-driven thin-film evaporation which is inherently coupled with the design and optimization of the evaporator wicks used in these devices. Here, we introduce a biomimetic evaporator wick design inspired by the peristome of the Nepenthes alata that can achieve significantly enhanced evaporative cooling. It consists of array of micropillars with multiple wedges along the sidewall of each micropillar. The efficacy of the wedged micropillar is evaluated based on a validated numerical model on the metrics of dryout heat flux and effective heat transfer coefficient. The wedge angle is chosen such that wedged micropillars cause liquid filaments to rise along the micropillar vertical walls. This results in a significant increase in thin-film area for evaporation. Additionally, the large mean curvature of the liquid meniscus produces strong capillary pumping pressure and simultaneously, the wedges increase the overall permeability of the wick. Consequently, our model predicts that the wedged micropillar wick can attain ~234% enhancement of dryout heat flux compared to a conventional cylindrical micropillar wick of similar geometrical dimensions. Moreover, the wedged micropillars can also attain higher effective heat transfer coefficient under dryout conditions thus outperforming the cylindrical micropillar in terms of heat transfer efficiency. Our study provide insight into the design and capability of the biomimetic wedged micropillars as an efficient evaporator wick for various thin-film evaporation applications.

Fluid Dynamics
Wicking Enhancement in Three-Dimensional Hierarchical Nanostructures.

Zhiting Wang,Junjie Zhao,Abhijeet Bagal,Erinn C. Dandley,Christopher J. Oldham,Tiegang Fang,Gregory N. Parsons,Chih-Hao Chang

DOI: https://doi.org/10.1021/acs.langmuir.6b01864

IF: 3.9

2016-01-01

Langmuir

Abstract:Wicking, the absorption of liquid into narrow spaces without the assistance of external forces, has drawn much attention due to its potential applications in many engineering fields. Increasing surface roughness using micro/nanostructures can improve capillary action to enhance wicking. However, reducing the structure length scale can also result in significant viscous forces to impede wicking. In this work, we demonstrate enhanced wicking dynamics by using nanostructures with three-dimensional (3D) hierarchical features to increase the surface area while mitigating the obstruction of liquid flow. The proposed structures were engineered using a combination of interference lithography and hydrothermal synthesis of ZnO nanowires, where structures at two length scales were independently designed to control wicking behavior. The fabricated hierarchical 3D structures were tested for water and ethanol wicking properties, demonstrating improved wicking dynamics with intermediate nanowire lengths. The experimental data agree with the derived fluid model based on the balance of capillary and vicious forces. The hierarchical wicking structures can be potentially used in applications in water harvesting surfaces, microfluidics, and integrated heat exchangers.
Design Optimization of Graded Three-Dimensional Micropillar Wicks for Vapor Chamber Evaporators

Shangyang Shi,Jianyu Du,Shuyan He,Hongxu Wu,Huaiqiang Yu,Chi Zhang,Yufeng Jin,Wei Wang

DOI: https://doi.org/10.1109/nems60219.2024.10639850

2024-01-01

Abstract:With the increasing power density of electronic devices combined with the development of advanced package technologies, thermal management has become an increasingly critical challenge. Passive heat spreaders such as vapor chambers provide a promising solution for mitigating hotspots. Vapor chambers operate with microporous wicks that move the working fluid via capillary action, while fluid vaporization from the wick menisci facilitates efficient heat dissipation. While many prior studies have focused on optimizing evaporator wick to increase the maximum capillary-limited heat flux, an equally important design goal is to minimize the thermal resistance of heat areas. In this study, we introduce a systematic modeling framework to optimize the design of segmented micropillar wicks consisting of diverse geometric zones and height variations corresponding to a specific heating configuration. Using the NSGA-II algorithm, we generate Pareto fronts of the optimal distributions of segmented micropillars with pitch ranging from 20-50 mu m and height ranging from 25-100 mu m. Our model captures the effect of varying interfacial meniscus shapes across the micropillar wick to determine the spatial distribution of temperature and heat flux. We find that optimized segmented wicks, featuring graded height and density, are capable of increasing the dry-out heat flux by 333% while reducing thermal resistance by 71% compared to homogeneous wicks. The specific fractions of each segment within the wick can vary depending on the targeted heat flux and thermal resistance operating criteria. This research provides useful design guidelines for graded, three-dimensional micropillar wicks and the same methodology can be extended to other types of wick structures as well.
Enhanced evaporation performance on a novel microstructured surface with vertical dimension gradient

Hongpeng Jiang,Xiaoliang Wang,Xinru Li,Jie Xu,Hong Qi,Debin Shan,Bin Guo

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2022.123478

IF: 5.2

2022-12-15

International Journal of Heat and Mass Transfer

Abstract:The wick design is critical for vapor chamber or flat heat pipes based on phase-change heat dissipation. Typically, the high-performance wick is governed by geometry, topology, and the microfabrication constraints. In this article, a novel microstructure incorporating gradient dimension optimization design is proposed to co-enhance the processes of thin film evaporation and capillary pumping. The numerical work systematically studies the parametric effect of wick porosity, contact angle, microstructure layout and Marangoni convection on the performance for different wicks. This novel structure with pyramid-like topology can promote the wick performance because it not only improves the capillary performance, but also shows high effective heat flux not that apparently influenced by contact angle. Meanwhile, the gradient cuboid microstructure and gradient microchannel are fabricated by a cost-effectively one-step hot micro-embossing process and compared with traditional microstructures by macro-scale evaporation test. The temperature distribution and excellent evaporation rate on gradient cuboid surface show satisfactory effect agrees with numerical results.

engineering, mechanical,thermodynamics,mechanics
Aluminum micropillar wicks integrated with boehmite nanostructures for rapid heat dissipation

Guang Yang,Bokai Yang,Xin Cheng,Shanshan Wang,Chunyu Li,Gang Liu,Jingyi Wu

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2024.125211

IF: 5.2

2024-01-27

International Journal of Heat and Mass Transfer

Abstract:The emergence of high-power semiconductors has resulted in the development of novel evaporators with efficient and low-superheat thermal dissipation. In this study, we comprehensively investigated an aluminum-based evaporator consisting of a micropillar array. Based on the thin-liquid-film evaporation theory, a functional relationship was derived to evaluate the heat transfer capability of the micropillar array with various geometrical parameters. A series of aluminum micropillar evaporators were fabricated through ion etching, and dense boehmite nanostructures were synthesized on the surfaces using boiling water treatment. The thermal performance of the evaporators was assessed in a vacuum chamber under controlled conditions. The experimental results quantitatively demonstrated the effect of micropillar structural parameters on the thermal performance of the evaporator. A critical heat flux of 217.4 W/cm 2 and a heat transfer coefficient of 102.3 kW/m 2 K were achieved for a sample with a pillar height of 500 μm, a unit size of 1200 μm, and a length-to-gap ratio of 1.27. This study provides insights into the design and fabrication of aluminum micropillar evaporators and contributes to the development of aluminum-based high heat flux thermal management devices.

engineering, mechanical,thermodynamics,mechanics
Capillary-Assisted Evaporation/Boiling in PDMS Microchannel Integrated with Wicking Microstructures

Wenming Li,Yogendra Joshi

DOI: https://doi.org/10.1021/acs.langmuir.0c01711

IF: 3.9

2020-10-20

Langmuir

Abstract:To enable rapid development of flexible microelectronic systems, effective thermal management is needed. Flexible polydimethylsiloxane (PDMS)-based microchannel flow boiling may provide a desirable solution. However, the heat transfer performance of PDMS-based microchannels is diminished by its poor thermophysical properties. The development of PDMS wick is proposed to address this dilemma. Herein, a new PDMS wick structure is designed and integrated in the microfluidic device to significantly enhance its thermal performance by promoting capillary-driven flow. Furthermore, to achieve highly efficient vapor removal, a dedicated vapor pathway is designed in the microfluidic device. Experiments have been conducted to investigate the capillary-assisted evaporation/boiling for mass flux ranging from 70 to 245 kg/m2 s on dielectric fluid HFE-7100. The capillary-assisted sustainable and stable thin film evaporation and efficient vapor removal have been demonstrated through the visualization studies. With this new wick design, the liquid rewetting at global and local levels is facilitated through the capillary-driven flow and the efficient vapor removal. This hybrid liquid rewetting mechanism is experimentally demonstrated to significantly enhance the capillary-assisted evaporation/boiling in PDMS-based microchannel. A critical heat flux (CHF) of 14.7 W/cm2 is achieved at a mass flux of 245 kg/m2 s. The heat transfer coefficients (HTC) range from 2000 to 9800 W/m2 K. These values are comparable to that in copper/silicon microchannels, with the aforementioned benefits of flexibility. Equally importantly, stable two-phase transport is achieved as well.
Thermal Performance of a Liquid-cooling Assisted Thin Wickless Vapor Chamber

Arani Mukhopadhyay,Anish Pal,Mohamad Jafari Gukeh,Constantine M. Megaridis

DOI: https://doi.org/10.1109/ITherm55368.2023.10177601

2024-04-30

Abstract:The ever-increasing need for power consumption in electronic devices, coupled with the requirement for thinner size, calls for the development of efficient heat spreading components. Vapor chambers (VCs), because of their ability to effectively spread heat over a large area by two-phase heat transfer, seem ideal for such applications. However, creating thin and efficient vapor chambers that work over a wide range of power inputs is a persisting challenge. VCs that use wicks for circulating the phase changing media, suffer from capillary restrictions, dry-out, clogging, increase in size and weight, and can often be costly. Recent developments in wick-free wettability patterned vapor chambers replace traditional wicks with laser-fabricated wickless components. An experimental setup allows for fast testing and experimental evaluation of water-charged VCs with liquid-assisted cooling. The sealed chamber can maintain vacuum for long durations, and can be used for testing of very thin wick-free VCs. This work extends our previous study by decreasing overall thickness of the wick-free VC down to 3 mm and evaluates its performance. Furthermore, the impact of wettability patterns on VC performance is investigated, by carrying out experiments both in non-patterned and patterned VCs. Experiments are first carried out on a wick-free VC with no wettability patterns and comprising of an entirely superhydrophilic evaporator coupled with a hydrophobic condenser. Thereafter, wettability patterns that aid the rapid return of water to the heated site on the evaporator and improve condensation on the condenser of the vapor chamber are implemented. The thermal characteristics show that the patterned VCs outperform the non-patterned VCs under all scenarios. The patterned VCs exhibit low thermal resistance independent of fluid charging ratio withstanding higher power inputs without thermal dry-outs.

Applied Physics,Hardware Architecture,Systems and Control
Daunomycin administered by continuous intravenous infusion is effective in the treatment of acute nonlymphocytic leukaemia

Jerry P. Lewis,F. Meyers,Leora Tanaka

DOI: https://doi.org/10.1111/j.1365-2141.1985.tb02824.x

1985-10-01

British Journal of Haematology

Abstract:Summary. Anthracyclines given by continuous infusion, as opposed to bolus administration, are associated with a reduced incidence of cardiac and gastrointestinal toxicity. Our study was developed to test the antileukaemic effect of anthracyclines given as a continuous infusion. Nineteen sequential patients admitted for treatment of acute nonlymphocytic leukaemia (ANLL) were managed with a regimen utilizing a 3 d continuous intravenous infusion of daunomycin (DNM), and the complete response rate was similar to this institution's past experience with antileukaemic regimens employing 3 d bolus DNM. In our studies, infusion DNM was at least as myelotoxic and antileukaemic as bolus DNM; thus this method of administration should be explored further in remission‐induction regimens for ANLL.
Cooling performance of a wick consisting of closely packed rods at moderately high heat loads

N. Kumar,V. S. Jasvanth,A. Ambirajan,J. H. Arakeri

DOI: https://doi.org/10.48550/arXiv.2009.01467

2020-09-03

Abstract:We propose a new class of wicks, consisting of closely packed circular rods, whose evaporative capacities have been measured at different heat loads ranging between 0.05W/cm^2 and 8W/cm^2. The experiments were performed with two different liquids, water and highly volatile pentane, in a specially designed setup to understand transient and steady state cooling characteristics of the proposed wicks. Heat interception and vapour release occur on the same side in these experiments. These wicks released ~50% of the supplied heat load as the latent heat; this value remained nearly constant between the explored heat loads. These wicks have the unique characteristic of potentially very high and rapid capillary rise induced by near-zero radii (NZR) of contacts formed between the rods in contact; liquid region reaching the end in NZR has been called corner meniscus. While the bulk liquid (present between three rods) may recede, depending on the heat load, the corner meniscus remains pinned; this unique feature thus leads to sustained high evaporation rate requirements. This remarkable characteristic seems advantageous compared to a regular wick, whose cooling performance depends on the heat loads. We also performed 3-D unsteady state numerical simulations to understand the effect of rod diameter and materials' thermal conductivity on the overall wick's performance. Steady state temperature value was in fairly good agreement with the ones measured in experiments. Based on the geometry of the corner film, fluid mechanics of liquid transport, and the heat transfer aspects, we present a design of suitable wicks as per the requirement. These new configurations can represent a separate class of wicks and may replace the regular wicks in current and futuristic cooling devices.

Fluid Dynamics,Applied Physics
Experimental study of a bilayer ceramic wick for the evaporator of a two-phase heat transfer device

Riadh Boubaker,Yannick Lorgouilloux,Safouene Ouenzerfi,Souad Harmand

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2024.125609

IF: 5.2

2024-04-28

International Journal of Heat and Mass Transfer

Abstract:In order to enhance the thermal performance of two-phase fluid loop devices, the purpose of this study is to investigate the benefit of using a bilayer wick in a capillary evaporator. In a homogenous wick, the porous structure characteristics present an intrinsic competition between increasing the capillary forces and reducing the pressure drop. Our investigation focuses on studying heat and mass transfer in uniform and bilayer ceramic wicks with the same porosity. The findings highlight the interest of a bilayer ceramic wick with a pore diameter gradient. This configuration exhibits heightened capillary pumping without compromising liquid pressure drop, leading to improved thermal performance in the evaporator. Our results demonstrate that opting for a bilayer ceramic with a pore diameter gradient can save up to 25 °C at the casing temperature and reach up to 1430 W/m2K −1 as heat transfer coefficient for a 70 W heat load value.

engineering, mechanical,thermodynamics,mechanics
Silicon Vapor Chamber with Hierarchical Micro-/Nano Wicks

Deyin Zheng,Xin Yu,Lin Chen,Wei Wang

DOI: https://doi.org/10.1109/icept63120.2024.10668635

2024-01-01

Abstract:A two-step processing method is developed for the fabrication of micro- and nano hierarchical wick structures on silicon substrate. Deep reaction ion etching (DRIE) was used to fabricate the primary wick, while the secondary wick structure was formed by electrochemical (EC) etching on the surface of the primary wick. The processing results show that the fabricated hierarchical wick structures consist of dense arrays of microscale trench and a uniformly distributed nanoporous layer with pore diameters less than 50nm. The merit of these hierarchical structures was demonstrated by thermal tests on the silicon vapor chamber integrated with such wicks. A prototype of the vapor chamber with 30 mm × 25 mm × 1.5 mm in dimension was developed as a passive heat spreader for thermal management of electronics. Thermal performance results indicate that the integration of hierarchical wick structures can significantly reduce the thermal resistance by ~50% compared with samples integrated with only microwick structures. Such an optimization on the thermal resistance indicates that integration of such hierarchical wick could be a promising method for the optimization of silicon-based thermal management devices.
Vapor chamber with two-layer liquid supply evaporator wick for high-heat-flux devices

Chao Liu,Dinghua Hu,Qiang li,Xuemei Chen,Zhiwei Zhang,Fan Zhou

DOI: https://doi.org/10.1016/j.applthermaleng.2021.116803

IF: 6.4

2021-05-01

Applied Thermal Engineering

Abstract:<p>Modern electronic devices with high heat flux increasingly exceed the capability of thermal management method. Two-phase thermal dissipation devices such as vapor chambers offer effective method for high heat flux cooling. Various new structural designs of vapor chambers are used as effective thermal control methods for high heat flux devices. However, the optimization criteria for the capillary wick structures are different. The combinations between the structural surface parameters and pore size of the capillary wick are different, while their influence on the heat transfer performance need to be studied. In this work, it is reported that the fabrication and thermal performance of vapor chambers with multi-layer sintered wicks and multi-artery wick design for liquid supply. We numerically and experimentally characterize the two types of sintered multi-artery wick for replenishing liquid and escaping vapor effectively with high heat flux. Three kinds of combinations of different copper particle sizes were applied to the sintered wicks in order to balance the liquid collecting rate and flow resistance. The copper particles of large particle size (60 μm /100 μm /150 μm) in the upper layer wick and copper particles of small particle size (30 μm /50 μm /100 μm) the lower layer wick were applied in the vapor chambers. In the present study, as an evaluation criteria for capillary wick designs, the relationship between surface porosity, surface area and critical heat flux was analyzed to obtain the experimental optimization of structural design and pore size combination as 50/100 μm. It was found that with similar multi-artery structure wicks, higher surface area porosity can effectively increase the critical heat flux of the vapor chambers. Judging from the experiment results, the minimum through-plane direction heat transfer resistance of the vapor chamber is 0.1426 K/W, the minimum in-plane direction heat transfer resistance is 0.016 K/W, while the critical heat flux of the vapor chamber is 262 W/cm<sup>2</sup>.</p>

energy & fuels,engineering, mechanical,thermodynamics,mechanics
Decrypting the mechanisms of wicking and evaporation heat transfer on micro-pillars during the pool boiling of water using high-resolution infrared thermometry

Chi Wang,Md Mahamudur Rahman,Matteo Bucci

DOI: https://doi.org/10.1063/5.0135110

IF: 4.6

2023-03-10

Physics of Fluids

Abstract:Surfaces with micrometer-scale pillars have shown great potential in delaying the boiling crisis and enhancing the critical heat flux (CHF). However, physical mechanisms enabling this enhancement remain unclear. This knowledge gap is due to a lack of diagnostics that allow elucidating how micro-pillars affect thermal transport phenomena on the engineered surface. In this study, for the first time, we are able to measure time-dependent temperature and heat flux distributions on a boiling surface with engineered micro-pillars using infrared thermometry. Using these data, we reveal the presence of an intra-pillar liquid layer, created by the nucleation of bubbles and partially refilled by capillary effects. However, contrarily to conventional wisdom, the energy removed by the evaporation of this liquid cannot explain the observed CHF enhancement. Yet, predicting its dry out is the key to delaying the boiling crisis. We achieve this goal using simple analytic models and demonstrate that this process is driven by conduction effects in the boiling substrates and, importantly, in the intra-pillar liquid layer itself. Importantly, these effects also control the wicking flow rate and its penetration length. The boiling crisis occurs when, by coalescing, the size of the intra-pillar liquid layer becomes too large for the wicking flow to reach its innermost region. Our study reveals and quantifies unidentified physical aspects, key to the performance optimization of boiling surfaces for cooling applications.

mechanics,physics, fluids & plasmas
Thermal performance enhancement of vapor chamber with modified thin screen mesh wick by laser etching

Tengqing Liu,Wentao Yan,Wei Wu,Shuangfeng Wang

DOI: https://doi.org/10.1016/j.csite.2021.101525

IF: 6.268

2021-12-01

Case Studies in Thermal Engineering

Abstract:In order to cope with high heat flux of miniaturized electronic devices in narrow space, vapor chamber has been developed towards ultra-thin thickness. In this study, a novel design of thin screen mesh with superhydrophilic micro structure was firstly proposed to enhance the thermal performance of thin vapor chamber (TVC). A layer of 0.12 mm thick screen mesh was employed as evaporator wick. The central area of the thin wick above heat input region was treated by laser etching to form superhydrophilic micro structure for improving capillary capability and providing nucleation sites. The upper sheet without wick was stamped to form support columns for preventing deformation and providing axial thermal conduction passage. Three TVCs (70 × 70 × 1.5 mm3) with various laser-etching area ratio (LEAR) of 0%, 66.6% and 83.3% were fabricated to study thermal performance of the novel TVCs. The results indicated that the novel evaporator mesh wick could remarkably enhance thermal performance of the TVCs. With LEAR increasing from 0% to 83.3%, the lowest thermal resistance RVC of TVC dropped from 0.431 K/W to 0.328 K/W, i.e. decreased 23.9%, and the maximum heat transfer capacity increased from 100 W to 120W, i.e. increased 20%.

thermodynamics
Heat Transfer Capacity Optimization Design of Microgroove and Microcolumn in an Ultra-Thin Flat Heat Pipe

Yitong Lv,Bo Wang,Zhihua Gan,Zitao Yu

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2024.125881

IF: 5.2

2024-01-01

International Journal of Heat and Mass Transfer

Abstract:Ultra-thin flat heat pipes (UFHPs) are being explored as a potential thermal management solution to address the heat dissipation challenges of electronic devices. However, the ultra-thin process increases fluid flow resistance and reduces the heat transfer capacity, posing challenges for wick structure optimization. In this study, the effects of wick structure, vapor space, and fluid flow properties on the maximum heat transfer capacity are analyzed by a fluid flow model. Microgroove and microcolumn as wick structures are optimized, and the coupling effects between capillary pressure and fluid flow resistances are analyzed. The maximum heat transfer capacity and the corresponding optimal wick structure dimensions are determined by the vapor space friction and wick structure friction, which are calculated by structural friction coefficients (Sv and Sl) and fluid friction coefficients (Fv and Fl). The models of fluid flow friction chosen in previous literature are validated for accuracy by Fluent. When the height of the wick structure (h) or vapor space (H) increases, the optimal dimensionless wick structure height (h*) increases and decreases under a fixed porosity (epsilon), respectively. The optimal h* of microgroove decreases and that of microcolumn increases as the dimensionless spacing (l*) increases. When ethanol is used as the working fluid, the optimal h* of microgroove is 1.98 and the optimal h* of microcolumn is 0.48, under the condition of H = 0.3 mm, h = 0.15 mm, and epsilon = 0.5. This model also emphasizes the importance of working fluid properties on the design of the wick structure, and a higher value of Fl/Fv results in a lower optimal h*. Moreover, methanol and acetone exhibit higher heat transfer capacity compared with ethanol. This study aims to provide comprehensive design principles for optimizing UFHP heat transfer capacity.
Ultrathin Aluminum Wick with Dual-Scale Microgrooves for Enhanced Capillary Performance

Guochen Jiang,Ze Tian,Xiao Luo,Changhao Chen,Xinyu Hu,Lizhong Wang,Rui Peng,Hongjun Zhang,Minlin Zhong

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2022.122762

IF: 5.2

2022-01-01

International Journal of Heat and Mass Transfer

Abstract:With the burgeoning development of electronic devices with higher heat flux, thinner volume, lighter weight, and flexibility, heat pipes and vapor chambers are facing big challenges, especially in fabricating high-performance wicks within limited space. Microgrooves have gained increasing interest for the ability to be directly curved on the substrates, whereas the capillary performance enhancement hits a bottleneck. In this study, a chemical-free ultrathin aluminum wick with dual-scale microgrooves was fabricated via two-step laser texturing in 0.3 mm thick AA6061. The resultant surface, composed of main microgrooves and periodic sub-microgrooves in the ridges and valleys, demonstrated enhanced capillary performance via capillary rise rate experiments. The interaction of liquids in dual-scale microgrooves, that was the pumping effect and the flow resistance reducing effect, would be the main reason for the capillary performance enhancement. The ultrathin aluminum wick with dual-scale microgrooves exhibited a K/R-eff about 1.322 mu m with a shallow depth of about 100 mu m, increased by 11.3% compared with that of single-scale microgrooves due to the assistance of the sub-microgrooves. This wick kept the ability to transport liquid under bending angles of 90 and 135 degrees. Moreover, the wicking performance of different liquids decreased with the decrease of surface tension to viscosity ratio. The ultrathin aluminum wick with dual-scale microgrooves showed enhanced capillary performance, which was among the best with thickness less than 200 mu m to our knowledge. This work provides insight into the design of high-performance wicks within limited space and weight. (C) 2022 Elsevier Ltd. All rights reserved.
Boosting water evaporation via continuous formation of a 3D thin film through triple-level super-wicking routes

Guochen Jiang,Lizhong Wang,Ze Tian,Changhao Chen,Xinyu Hu,Rui Peng,Daizhou Li,Hongjun Zhang,Peixun Fan,Minlin Zhong

DOI: https://doi.org/10.1039/d3mh00548h

2023-08-29

Abstract:Capillary-fed thin-film evaporation via micro/nanoscale structures has attracted increasing attention for its high evaporation flux and pumpless liquid replenishment. However, maximizing thin-film evaporation has been hindered by the intrinsic trade-off between the heat flux and liquid transport. Here, we designed and fabricated nanostructured micro-steam volcanoes on copper surfaces featuring triple-level super-wicking routes to overcome this trade-off and boost water evaporation. The triple-level super-wicking routes enable the continuous formation of a 3D thin film for highly efficient evaporation by continuous self-driven liquid replenishment and extending the thin-film region. The micro-steam volcanoes increased the surface area by 225%, improving the evaporation rate by 141%, with a rapid self-pumping water transport speed up to 80 mm s-1. A remarkable solar-driven water evaporation rate of 3.33 kg m-2 h-1 under one sun vertical incidence was achieved, which is among the highest reported values for metal-based evaporators. When attached to electric-heating plates, the evaporator realized an electrothermal evaporation rate of 12.13 kg m-2 h-1. Moreover, it can also be used for evaporative cooling with enhanced convective heat transfer, reaching a 36.2 °C temperature reduction on a heat source with a heat flux of 6 W cm-2. This study promises a general strategy for designing thin-film evaporators with high efficiencies, low costs, and multi-functional compatibilities.
Experimental and computational investigation on synergistic enhancement spray cooling using micropillars and capillary-driven wicking hybrid structures

Qin Ni,Wenjie Lu,Xiang Ling

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2023.124643

IF: 5.2

2023-01-01

International Journal of Heat and Mass Transfer

Abstract:Spray cooling, which has a fast thermal response and low flow rate consumption, is a common and effective thermal management approach for high power electronic systems. Typically, to improve the heat transfer co-efficient (HTC) for spray cooling, the target surface wettability is decreased, promoting nucleation boiling by reducing the surface energy barrier for bubble nucleation. However, the merging of bubbles and the formation of a vapor film have limitations in further increasing the critical heat flux (CHF). Hence, maximizing both the HTC and CHF of spray cooling can be mutually exclusive on the same heated surface. This paper presented a novel design for a vapor-liquid separation structure surface. It consisted of lower micropillars that serve as the vapor separation channel. On top of that, there was an upper multi-layer copper micromesh that wicks and spreads the coolant. Additionally, nano-grass attached to the micromesh to enhance capillary force and increase the nucleation sites simultaneously. Subsequently, we calculated the forward velocity and pressure drop of the droplets passing through the copper mesh to study the effects of droplet velocity and capillary force on heat transfer performance. The results show that the forward velocity of the droplets decreases rapidly as the increase of copper mesh layers and it drops to zero when passing through the third mesh. Therefore, the capillary force generated by the copper mesh is another important factor for the atomized droplets to pass through the copper mesh and reach the target surface. We have proven that all the vapor-liquid separation structure surfaces satisfy the condition Delta Pcap>Delta Ppore+Delta Plocal. Hence, the synergistic effects of the micropillar, copper micromesh, and nano-grass enable a circulation process of wicking-rewetting-vapor evacuation, which improves the onset of nucleate boiling (ONB), enhances the HTC, and increases the maximum heat flux dissipated by the system. Enhanced HTC (7.94 W/cm2/K) and maximum heat flux (817 W/cm2) were achieved at 1.50 ml/s on the vapor-liquid separation structure surfaces (#200 2-layer), representing an enhancement of 79.6% and 80.0% compared with that for the flat surface and the temperature of the heated surface at the ONB maximum decreased by approximately 30.8 degrees C.
Evaluation of Thermal Performance of a Wick-free Vapor Chamber in Power Electronics Cooling

Arani Mukhopadhyay,Anish Pal,Congbo Bao,Mohamad Jafari Gukeh,Sudip K. Mazumder,Constantine M. Megaridis

DOI: https://doi.org/10.1109/ITherm55368.2023.10177653

2024-04-30

Abstract:Efficient thermal management in high-power electronics cooling can be achieved using phase-change heat transfer devices, such as vapor chambers. Traditional vapor chambers use wicks to transport condensate for efficient thermal exchange and to prevent "dry-out" of the evaporator. However, wicks in vapor chambers present significant design challenges arising out of large pressure drops across the wicking material, which slows down condensate transport rates and increases the chances for dry-out. Thicker wicks add to overall thermal resistance, while deterring the development of thinner devices by limiting the total thickness of the vapor chamber. Wickless vapor chambers eliminate the use of metal wicks entirely, by incorporating complementary wettability-patterned flat plates on both the evaporator and the condenser side. Such surface modifications enhance fluid transport on the evaporator side, while allowing the chambers to be virtually as thin as imaginable, thereby permitting design of thermally efficient thin electronic cooling devices. While wick-free vapor chambers have been studied and efficient design strategies have been suggested, we delve into real-life applications of wick-free vapor chambers in forced air cooling of high-power electronics. An experimental setup is developed wherein two Si-based MOSFETs of TO-247-3 packaging having high conduction resistance, are connected in parallel and switched at 100 kHz, to emulate high frequency power electronics operations. A rectangular copper wick-free vapor chamber spreads heat laterally over a surface 13 times larger than the heating area. This chamber is cooled externally by a fan that circulates air at room temperature. The present experimental setup extends our previous work on wick-free vapor chambers, while demonstrating the effectiveness of low-cost air cooling in vapor-chamber enhanced high-power electronics applications.

Systems and Control,Hardware Architecture,Applied Physics
Characterization of evaporation and boiling from sintered powder wicks fed by capillary action

Justin A. Weibel,Suresh V. Garimella,Mark T. North

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2010.05.043

IF: 5.2

2010-09-01

International Journal of Heat and Mass Transfer

Abstract:The thermal resistance to heat transfer into the evaporator section of heat pipes and vapor chambers plays a dominant role in governing their overall performance. It is therefore critical to quantify this resistance for commonly used sintered copper powder wick surfaces, both under evaporation and boiling conditions. The objective of the current study is to measure the dependence of thermal resistance on the thickness and particle size of such surfaces. A novel test facility is developed which feeds the test fluid, water, to the wick by capillary action. This simulates the feeding mechanism within an actual heat pipe, referred to as wicked evaporation or boiling. Experiments with multiple samples, with thicknesses ranging from 600 to 1200μm and particle sizes from 45 to 355μm, demonstrate that for a given wick thickness, an optimum particle size exists which maximizes the boiling heat transfer coefficient. The tests also show that monoporous sintered wicks are able to support local heat fluxes of greater than 500Wcm−2 without the occurrence of dryout. Additionally, in situ visualization of the wick surfaces during evaporation and boiling allows the thermal performance to be correlated with the observed regimes. It is seen that nucleate boiling from the wick substrate leads to substantially increased performance as compared to evaporation from the liquid free surface at the top of the wick layer. The sharp reduction in overall thermal resistance upon transition to a boiling regime is primarily attributable to the conductive resistance through the saturated wick material being bypassed.

engineering, mechanical,thermodynamics,mechanics

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