Abstract:Abstract Laser micromachining has attracted considerable interest because of its wide range of applications across nearly all manufacturing sectors and mostly in semiconductors such as silicon. However, modern micro-manufacturing demands progressive product miniaturization, high accuracy, and high-precision material removal. For this purpose, a fundamental study of the interaction between ultrashort laser pulses and silicon will be valuable for studying ablation characteristics and ablation performance. The femtosecond laser pulse interaction with the silicon is divided into five parts: (a) the interaction of laser light with the carriers, (b) variation of the carrier density and carrier temperature, (c) energy exchange between carriers and lattice, (d) thermomechanical response of the material, and (e) ablation. The evolution of the carrier density and carrier-lattice energy coupling equation is solved simultaneously to determine the optimum value of the ablation width and ablation depth of femtosecond laser pulses on the silicon. The first time, 2D axial symmetry thermal and non-thermal ablation profiles were compared with the experimental result at fluence ranging from 0.75 to 9 J cm −2 at the wavelength of 515 nm and 180 fs laser on the silicon sample. A comparative study of damage thresholds from experiments and simulations is presented. The concordance between model calculations and experimental data demonstrates that fs laser ablation is thermal in nature in low fluence regime, whereas it is non- thermal in a high-fluence regime. Fundamental information such as the time evolution of the carrier density, carrier temperature evolution, and lattice temperature evolution can be obtained from the simulation results.

Numerical investigation of heat transfer in ultrafast laser processing of silicon material

Combined Continuum-Atomistic Modeling of Ultrashort-Pulsed Laser Irradiation of Silicon

Numerical Analysis of Ultrashort Pulse Laser-Induced Thermomechanical Response of Germanium Thin Films

Thermal and non-thermal ablation mechanisms in crystalline silicon by femtosecond laser pulses: classical approach of the carrier density two temperature model

Numerical Investigation of the Kinetics of Non-Equilibrium Phase Transitions in Silicon Induced by an Ultra-Short Laser Pulse

Numerical Simulation of Vaporization Effect of Long Pulsed Laser Interaction with Silicon

Numerical Simulations of Germanium Nanofilm under Femtosecond Pulse Laser Heating

Energy Transfer Between Femtosecond Laser and Silicon Carbide

Theoretical Investigation of Multipulse Femtosecond Laser Processing on Silicon Carbide: Ablation, Shielding Effect, and Recast Formation

Micro- and Nanoscale Heat Transfer in Femtosecond Laser Processing of Metals

A Hybrid Method for Integrated Atomistic-Continuum Simulation of Ultrashort-Pulsed Laser Interaction with Semiconductors

Numerical Insight into Heat Transfer in Surface Melting and Ablation Subject to Femtosecond Laser Processing Aluminum

Finite element model for femtosecond laser pulse heating using dual phase lag effect

The Experimental and Modeling Study of Femtosecond Laser-Ablated Silicon Surface

The ultrashort pulse laser ablation model of silicon based on the generalized thermoelastic theory with spatio-temporal nonlocal effect

A fractional dual-phase-lag generalized thermoelastic model of ultrashort pulse laser ablation with variable thermal material properties, vaporization and plasma shielding

Ultrafast heat transfer dynamics induced by femtosecond laser pulse in fused silica

Time-resolved Temperature Measurement and Numerical Simulation of Millisecond Laser Irradiated Silicon

Numerical Simulation of Femtosecond Laser Heating of Metal Films Using Electron Thermal Emission

Numerical Analysis and Experimental Verification of Time-Dependent Heat Conduction under the Action of Ultra-Short Pulse Laser

Femtosecond-Laser-Ablation Dynamics in Silicon Revealed by Transient Reflectivity Change