Silicon mitigates the negative impacts of salt stress in soybean plants

Kolima Peña-Calzada,Dilier Olivera-Viciedo,Alexander Calero-Hurtado,Renato de Mello Prado,Eduardo Habermann,Luis Felipe Lata Tenesaca,Gabriela Ajila,Reginaldo de Oliveira,Juan Carlos Rodríguez,Priscila Lupino Gratão
DOI: https://doi.org/10.1002/jsfa.12503
Abstract:Background: Soybean is widely cultivated around the world, including regions with salinity conditions. Salt stress impairs plant physiology and growth, but recent evidence suggests that silicon (Si) is able to mitigate this stressful condition. Therefore, the purpose of this study was to evaluate how different strategies of Si application impact on salt stress tolerance of an intermediate Si accumulator species (soybean). Therefore, we applied four treatments: Si-untreated plants (Si 0); foliar spraying at 20 mmol L-1 (Si F); nutritive solution addition at 2.0 mol L-1 (Si R), and combined foliar spraying at 20 mmol L-1 plus nutritive solution at 2.0 mmol L-1 (Si F + R). We investigated how Si application modified growth, leaf gas exchange, photosynthetic pigments, chlorophyll fluorescence, relative water content (RWC), nutrient accumulation, and ion homeostasis of soybean plants submitted to different levels of salt stress (50 and 100 mmol L-1 NaCl). Results: Salinity induced an expressive reduction in ion accumulation, plant water status, and growth of soybean, while Si application promoted contrary effects and increased potassium (K+ ) accumulation, water status, photosynthetic pigment content, chlorophyll fluorescence parameters, and gas exchange attributes. Additionally, Si application enhanced Si accumulation associated with decreased Na+ uptake and improved morpho-physiological growth. Conclusion: The use of exogenous Si can be an efficient strategy to attenuate the harmful effects of salt stress in soybean plants. The best application strategy was observed with combined foliar spraying with Si included in the nutritive solution (Si F + R). © 2023 Society of Chemical Industry.
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