Modeling and validation of evaluation method on IC chip pick-up performance of dicing/die bonding tape

N. Saiki,K. Inaba,K. Kishimoto,H. Seno,Isao Ichikawa

DOI: https://doi.org/10.1109/ESTC.2010.5642966

2010-11-22

Abstract:A method to evaluate pick-up performance of dicing/die bonding tapes has been developed numerically and experimentally. In the pick-up process, IC chip with adhesive film is peeled off the base material, by pushing the backside of the base material with protruding needles. As the result of peel test and pick-up test, there were two types of pick-up behaviors correlated to the peeling behaviors. The peel force of one type decreased as the peel speed increased, and the peel initiation was critical in the pick-up test. In the evaluation method, the minimum needle displacement of peel initiation was estimated by the shear stress around protruding needles. The peel force of other type increased as the peel speed increased, and the peel propagation was critical in the pick-up test. In the evaluation method, the peel energy was calculated from the peel force. The finite element method was applied to calculate the energy release rate of the pick-up process for various peel lengths. The minimum needle displacement to complete the peel propagation was estimated by comparing the peel energy and the energy release rate. The predicted minimum needle displacements in both cases were in good agreement with the experimental results.