Softening of fused‐silica capillaries during particle packing

Jingqing Chen,M. Dulay,R. Zare
DOI: https://doi.org/10.1002/(SICI)1522-2683(20000401)21:7<1430::AID-ELPS1430>3.0.CO;2-B
2000-04-01
Electrophoresis
Abstract:When a semipreparative capillary electrochromatography (CEC) capillary is packed with silica particles and exposed to solvent, its mechanical strength is markedly reduced. In our studies, a fused‐silica capillary (internal diameter > 200 μm and wall thickness < 150 μm) was packed under pressure (approximately 200 psi) with spherical silica particles (1.5—5 μm) suspended in water or various common organic solvents. After one hour of exposure, the capillary can be readily deformed, and it keeps its deformed shape upon release of the force causing deformation. It is suggested that capillary softening is promoted through the propagation of internal microcracks that have been caused by action of the particles during packing in the presence of solvent. Application of a protective coating to the inside of the capillary is found to reduce or eliminate capillary softening.
What problem does this paper attempt to address?