The effect of initial temperature and oxygen ratio on air-methane catalytic combustion in a helical microchannel using molecular dynamics approach

Qing An,Ali Basem,As'ad Alizadeh,Ameer H. Al-Rubaye,Dheyaa J. Jasim,Miao Tang,Soheil Salahshour,Rozbeh Sabetvand
DOI: https://doi.org/10.1016/j.csite.2024.104062
IF: 6.268
2024-01-29
Case Studies in Thermal Engineering
Abstract:In industrial environments where combustion (Com.) is widely carried out, such as steam power plants, gas turbines, etc., the most common way to express the amount of oxygen consumption is its excess percentage in addition to the stoichiometric ratio. And the nearness of a catalyst causes Com. to happen at a high ratio. There are different influential factors in catalytic Com., such as initial temperature (IT). The current study used the molecular dynamics (MD) method to examine how the IT and oxygen ratio affect air-methane catalytic Com. in a helical microchannel. The LAMMPS package was used to conduct this investigation. This study examined how simulated structures function during burning in excess oxygen (EO) and oxygen deficiency (OD). Furthermore, palladium was used as a catalyst with an atomic ratio of 4 %. The findings show that raising the structure's IT may enhance its atomic behavior (AB) and thermal performance (TP). The maximum velocity (MV) and maximum temperature (MT) increased from 0.26 Å/ps and 1617 K to 0.45 Å/ps and 1891 K in EO as IT increased from 300 to 700 K. By accelerating the particle velocity, it is anticipated that the catalytic Com. process would proceed more quickly. As a result, after increasing the IT to 700 K, the atomic samples' heat flux (HF), thermal conductivity (TC), and combustion efficiency (CE) increased to 2101 W/m 2 , 1.23 W/m. K, and 93 %, respectively. On the other hand, the results show that increasing IT affects Com. performance in the presence of OD. In the presence of OD, the MV and CE converged to 0.38 Å/ps and 94 % at 700 K. Therefore. It can be concluded that the atomic ratio of oxygen and the IT can significantly affect the Com. process.
thermodynamics
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