Surface Etching of Polymeric Semiconductor Films Improves Environmental Stability of Transistors
Chenyang Zhai,Xiaohui Yang,Songyu Han,Guanghao Lu,Peng Wei,Andrei Chumakov,Elisabeth Erbes,Qing Chen,Simone Techert,Stephan V. Roth,Peng Zhang,Laju Bu
DOI: https://doi.org/10.1021/acs.chemmater.1c00628
IF: 10.508
2021-03-29
Chemistry of Materials
Abstract:Solution-processed polymeric semiconductor films are attracting wide interest for applications in flexible electronics, wherein environmental stability is still a big obstacle. In many polymeric thin-film electronic devices, vertical phase separation has been observed, which leads to film depth dependences of electronic properties. Here, a soft plasma-assisted surface etching method to improve the environmental stability and maintain the electronic properties of organic field-effect transistors (OFETs) is proposed, by which the unwanted thin-film surface (exposed to air) is selectively taken away upon soft plasma etching, and the layer beneath the surface (subsurface) is preserved without any damage to the subsurface's structure or electronic function. Investigation of frequently used polymeric semiconductors poly(3-hexylthiophene) and poly[4-(4,4-dihexadecyl-4<i>H</i>-cyclopenta[1,2-<i>b</i>:5,4<i>b</i>′]dithiophen-2-yl)-alt [1,2,5]thiadiazolo[3,4-<i>c</i>]pyridine] shows that the crystallinity of the surface layer is higher than that of the subsurface layer. However, for p-type polymeric semiconductors, higher crystallinity usually leads to a lower ionization energy and higher doping concentration during exposure to air and thus a higher background conductivity, deteriorating the switching-off capability of the organic field-effect transistors (OFETs). Therefore, by removing this surface layer, the lifetime of OFETs in air is effectively increased by over 50%.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acs.chemmater.1c00628?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acs.chemmater.1c00628</a>.Transfer curves ((−<i>I</i><sub>D</sub>)<sup>1/2</sup>–<i>V</i><sub>G</sub>) for unetched and etched P3HT transistors; output curves of unetched and etched P3HT transistors; on/off ratio and field-effect mobility of unetched and etched P3HT transistors; transfer curves of PCDTPT transistors measured in different conditions; transfer curves ((−<i>I</i><sub>D</sub>)<sup>1/2</sup>–<i>V</i><sub>G</sub>) for unetched and etched PCDTPT transistors; <i>V</i><sub>ON</sub>, field-effect mobility and <i>SS</i><sup>–1</sup> of unetched and etched PCDTPT transistors; output curves of unetched and etched PCDTPT transistors; schematic diagram and transfer curve PCDTPT transistor (etched before the deposition of electrodes); dual sweep transfer and output curves of P3HT and PCDTPT transistors; the effect of thickness on PCDTPT transistors performance; the effect of encapsulation on PCDTPT transistors performance; and the effect of crystallinity on DPP-DTT transistors performance (<a class="ext-link" href="/doi/suppl/10.1021/acs.chemmater.1c00628/suppl_file/cm1c00628_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,chemistry, physical