Abstract:3D surface conformal circuits are widely utilized in the fabrication of communication, automotive, medical and confidential electronic products. Special techniques, like the three-dimensional molded interconnect devices (3D-MID) technology, have been developed for manufacturing of the conformal circuits on the surfaces of injection molded plastic structures with complicated 3D shapes. However, the 3D-MID fabrication of conformal circuits involves an electro-/chemical plating process. Due to environmental protection requirements and its incompatibility with traditional electronic manufacturing processes, the application of this technique is largely limited. In this work, surface conformal circuits were fabricated additively by a modified screen-printing technology. An adaptive partition principle was proposed for reconstructing the complex 3D structure surfaces. Flexible screen receptacles were used instead of the traditional rigid ones. Nano-silver pastes were applied for the circuit printing. The obtained conformal circuit has a length range of 142~300 mm and a maximum aspect ratio of 320:1. The circuit thickness could be controlled in the range of 3-10 μm . Line width deviation was less than ± 50 μm. Linewidth consistency was better than ± 43 μm. The resistivity of the connection wires printed by the nano-silver paste were 16.2 ± 0.2 μΩ•cm. The curvatures of the 3D surfaces covered by the conformal circuits changed from -1000 m-1 to 1000 m-1. After being stored at - 40 °C and 150 °C for 72 hours, no obvious deformation, peel-off and degradation in electrical properties were detected. By using conformal circuits, the structural design of an LED luminaire has been improved to achieve miniaturization and better heat dissipation. The modified screen-printing technology presented is a cheap and reliable method for fabricating complex 3D conformal circuits and it is well compatible to traditional electronic manufacturing processes.

Dynamically Conformal Mask Printing of Liquid Alloy Circuits on Morphing Objects

Liquid Alloy Circuits: Dynamically Conformal Mask Printing of Liquid Alloy Circuits on Morphing Objects (Adv. Mater. Technol. 6/2021)

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3D Printing of Reprogrammable Liquid Crystal Elastomers with Exchangeable Boronic Ester Bonds

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Modular 4D Printing Via Interfacial Welding of Digital Light-Controllable Dynamic Covalent Polymer Networks

Additive Fabrication of 3D Surface Conformal Circuits Using a Modified Screen-Printing Technology

Soft shape-programmable surfaces by fast electromagnetic actuation of liquid metal networks

Programmable robotized ‘transfer-and-jet’ printing for large, 3D curved electronics on complex surfaces

Facile method for 3D printing conformally onto uneven surfaces and its application to face masks

Fast Digital Patterning of Surface Topography Toward Three-Dimensional Shape-Changing Structures

Three-Dimensional Coprinting Of Liquid Metals For Directly Fabricating Stretchable Electronics

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Additive Manufacturing of Conformable Electronics on Complex Objects Through Combined Use of Liquid Metal Ink and Packaging Material

3D Printing of Near-Ambient Responsive Liquid Crystal Elastomers with Enhanced Nematic Order and Pluralized Transformation

Hybrid Transfer Printing of Liquid Metals and Allied Inks for Rapid Fabrication of Multifunctional Soft Electronics.

Self‐Healing Kirigami Assembly Strategy for Conformal Electronics

Computational Design and 3D Weaving of 2D-Printable Conformal Flexible Electronics Using Harmonic Foliation Theory

A dynamically reprogrammable surface with self-evolving shape morphing

Pneumatic Enabled Vertical Interconnect Access of Liquid Alloy Circuits toward Highly Integrated Stretchable Electronics

Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics