Effect of Epoxy Conductive Adhesive on Film Deformation During the Thermoforming Process for In‐Mold Electronic Devices

Francisco Ituriel Arias‐García,Nekane Lozano‐Hernandez,Maria Lluisa Maspoch Ruldua,Enric Fontdecaba Baig
DOI: https://doi.org/10.1002/admt.202401026
IF: 6.8
2024-10-11
Advanced Materials Technologies
Abstract:If you break it, you lose it: In‐Mold Electronics enables the integration of circuits into more complex scenarios, yet the key challenge remains ensuring a fully functional device. This study compares printed and hybridized samples during thermoforming. Results show adhesive affects deformation, causing irregular stretching in the nearby areas. Designers must consider adhesive influence to optimize functionality in these devices. In‐Mold Electronics (IME) is an innovative technology that allows the creation of 3D‐shaped electronic surfaces by combining printed electronics and In‐Mold Decoration (IMD). During the manufacturing process, the materials that integrate these devices, such as adhesive, must endure the transformation conditions of thermoforming. However, the adhesive rigidity may influence the deformation of the film during this process. In this study, both printed and hybridized samples are compared regarding their stretching and thickness reduction during the thermoforming process. The results indicate that the deformation of the hybridized samples differs from the printed ones, resulting in less stretching in areas near the adhesive, with stretching increasing as it steps away from where it is deposited. Thickness values are also affected, being greater around the adhesive and decreasing farther away. Therefore, the presence of the adhesive significantly impacts the behavior of the film during processing, a factor that must be considered in the design of IME devices to maximize the number of functional devices.
materials science, multidisciplinary
What problem does this paper attempt to address?