Crosstalk Delay and Reliability Analysis of Carbon Nanotube On-Chip Interconnects: Modelling and Optimization using Metaheuristic Algorithm

Ritika Sharma Mayank Kumar Rai Rajesh Khanna Department of Electronics and Communication Engineering,Thapar Institute of Engineering and Technology,Patiala 147004,IndiaRitika Sharma received a Btech degree in ECE in 2014 from IET Bhaddal,Ropar and completed ME degree from Thapar Institute of Engineering and Technology,Patiala,India in 2018. Presently she is pursuing PhD from Thapar Institute of Engineering and Technology,Patiala. Her research mainly includes VLSI interconnects and microstrip patch antenna.Mayank Kumar Rai received his BE in electronics & communication from M.J.P. Rohilkhand University,Bareilly,Mtech from CDAC Noida in 2007,and PhD from Thapar Institute of Engineering and Technology,Patiala,India in 2014. Currently,he is a professor in ECED at Thapar Institute,Patiala. With 53 publications and Rs 1.2 crore in project funding,his research focuses on carbon nanotube-based VLSI interconnects,analogue VLSI design,nanotechnology,and hyperthermia applicators. Email: ajesh Khanna received his BSc (Engg.) in ECE from REC,Kurukshetra in 1988 and his ME from IISc,Bangalore in 1998. He worked at Hartron R&D until 1993 and as assistant station engineer at AIR until 1999. Currently,he is a professor in ECED at Thapar Institute of Engineering and Technology,Patiala,India. With 136 publications in national and international journals/conferences and Rs 1.8 crore in project funding,his research focuses on antennas,wireless communication,and MIMO systems. Email: rkhanna@thapar.edu

DOI: https://doi.org/10.1080/03772063.2024.2423263

IF: 1.8768

2024-11-09

IETE Journal of Research

Abstract:In the field of VLSI technology, the miniaturization of ICs poses significant challenges to overall interconnect performance, particularly due to the rising concerns of crosstalk-induced reliability and durability issues. This work explores graphene-based randomly mixed carbon nanotube bundle (RMCB) interconnects as a viable solution for advanced reliable VLSI applications. Employing metaheuristic algorithms (Maximum Hole Degree, Particle Swarm Optimization, Stoyan and Yaskov Algorithm), this study seeks to optimize RMCB structures, maximizing carbon nanotube density within a fixed area. Notably, this study explores the effectiveness of algorithms' performance in optimizing RMCB structures at a nano-technology node. Extensive signal integrity and reliability assessments, considering both rugged and pristine substrates, reveal that Stoyan and Yaskov (SY)-based optimization excels over PSO and MHD-based counterparts in terms of on-chip interconnect performance and reliability. The SY structure significantly dominates MHD-based (and PSO) counterparts by reducing crosstalk delay by 50% (30%), enhancing the average failure rate by 40% (37%), and improving electromigration reliability by 170% (63%).

telecommunications,engineering, electrical & electronic