High-Sensitivity and Wide-Range Flexible Ionic Piezocapacitive Pressure Sensors with Porous Hemisphere Array Electrodes

Bang Wu,Weiguang Wu,Rui Ma,Haobing Chen,Yilin Zhao,Yunfan Li,Xiao Lei,Feng Liu

DOI: https://doi.org/10.3390/s24020366

IF: 3.9

2024-01-09

Sensors

Abstract:The development of high-performance flexible pressure sensors with porous hierarchical microstructures is limited by the complex and time-consuming preparation processes of porous hierarchical microstructures. In this study, a simple modified heat curing process was first proposed to achieve one-step preparation of porous hemispherical microstructures on a polydimethylsiloxane (PDMS) substrate. In this process, a laser-prepared template was used to form surface microstructures on PDMS film. Meanwhile, the thermal decomposition of glucose monohydrate additive during heat curing of PDMS led to the formation of porous structures within PDMS film. Further, based on the obtained PDMS/CNTs electrodes with porous hemisphere array and ionic polymer dielectric layers, high-performance ionic piezocapacitive sensors were realized. Under the synergistic effect of the low-stiffness porous hemisphere microstructure and the electric double layer of the ionic polymer film, the sensor based on an ionic polymer film with a 1:0.75 ratio of P(VDF-HFP):[EMIM][TFSI] not only achieves a sensitivity of up to 106.27 kPa−1 below 3 kPa, but also has a wide measurement range of over 400 kPa, which has obvious advantages in existing flexible piezocapacitive sensors. The rapid response time of 110 s and the good stability of 2300 cycles of the sensor further elucidate its practicality. The application of the sensor in pulse monitoring, speech recognition, and detection of multiple dynamic loads verifies its excellent sensing performance. In short, the proposed heat curing process can simultaneously form porous structures and surface microstructures on PDMS films, greatly simplifying the preparation process of porous hierarchical microstructures and providing a simple and feasible way to obtain high-performance flexible pressure sensors.

engineering, electrical & electronic,chemistry, analytical,instruments & instrumentation

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to develop a flexible ion - piezocapacitive pressure sensor with high sensitivity and a wide measurement range. Traditional flexible piezocapacitive sensors have a limited thickness, resulting in low sensitivity to external pressure changes and limiting their application range. In order to improve the sensitivity of the sensor, in recent years, researchers have introduced ionic polymer films or microstructures. However, these methods are usually accompanied by a reduction in the sensor's measurement range, thus limiting the sensor's application.

This paper proposes a simply modified thermal curing process. By combining a laser - assisted template and a glucose monohydrate additive, a porous hemispherical array structure is prepared on a polydimethylsiloxane (PDMS) film in one step. The combination of this porous hierarchical microstructure and the ionic polymer film can not only significantly improve the sensitivity of the sensor, but also maintain a wide measurement range. Specifically, a sensor based on a 10×10 porous hemispherical array and a P(VDF - HFP):[EMIM][TFSI] ionic polymer film with a ratio of 1:0.75 has a sensitivity as high as 106.27 kPa\(^{-1}\) under a pressure lower than 3 kPa and has a wide measurement range exceeding 400 kPa. In addition, the sensor also has a fast response time and good stability, further verifying its practicality.

In conclusion, this research aims to provide an efficient and low - cost method to obtain high - performance flexible pressure sensors by simplifying the preparation process of the porous hierarchical microstructure.