Analysis of plasma etching reactivity of bismuth aluminosilicate glasses using fluorine concentration

Young Min Byun,Jae Ho Choi,Won Bin Im,Hyeong-Jun Kim
DOI: https://doi.org/10.1016/j.jnoncrysol.2024.122883
IF: 4.458
2024-02-24
Journal of Non-Crystalline Solids
Abstract:Al 2 O 3 was replaced with AlF 3 in the composition of bismuth aluminosilicate glasses, and the resistance of the resulting glasses to CF 4 /Ar/O 2 plasma was tested. The results were interpreted from the standpoint of glass structure. The resistance to plasma etching increased as the F concentration in the glass increased. After etching, all samples retained a smooth surface structure, and no craters or reactive structures were detected in the microstructure. The formation of Al-F bonds in the glass was confirmed by nuclear magnetic resonance spectroscopy. The increase in plasma resistance at higher F concentrations suggests that the fluorine bonds in the glass structure are involved in decreasing the etching rate. This is possibly due to the higher sublimation temperature of AlF x , which retards the fluorocarbon plasma reaction.
materials science, multidisciplinary, ceramics
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