Abstract:Tunable conductive polymer composite is developed for printed electronics. Multi‐material fused deposition modeling is used to print and embed the bendable structures which can be used either as sensors or the circuit elements. Tuning of the filler materials, morphologies, and concentrations is studied and used to determine the electrical and mechanical properties of the printed filaments. Multimaterial 3D printing is an attractive route for low‐cost fabrication of electronic systems having different types of embedded devices. Herein, tunable thermoplastic polyurethane (TPU)‐based conductive composite filaments are presented for development of either strain sensors or different circuit elements. The filaments are developed with two filler materials, namely, silver and multiwalled carbon nanotubes (MWCNT). The influences of filler aspect ratio (AR), concentration, functionalization, and morphology on the composites' mechanical, thermal, and electrical properties are studied. Printed tracks of the 10 wt% high‐AR MWCNT/TPU filament exhibit a maximum electrical conductivity of 0.92 S cm−1 and withstand powers >1 W and currents >100 mA. The filament shows negligible change in impedance over the frequency range 1 kHz–1 MHz and a change in the resistance of <5% with 90° bending. Conversely, printed tracks using filaments with 3 wt% low‐AR MWCNT exhibit a change in resistance of ≈30% with 90° bending, allowing a clear distinction between various bending angles, and thus could be used for embedded strain/bend sensors. These results suggest that, with the correct optimization, multimaterial additive manufacturing can be utilized with tunable conductive filaments to fabricate complex 3D electronic systems by constructing reliable circuit tracks, bendable interconnects, and sensors.

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