Abstract:Conducting polymers have attracted great attention since the discovery of high conductivity in doped polyacetylene in 1977(1). They offer the advantages of low weight, easy tailoring of properties and a wide spectrum of applications(2,3). Due to sensitivity of conducting polymers to environmental conditions (e.g., air, oxygen, moisture, high temperature and chemical solutions), lithographic techniques present significant technical challenges when working with these materials(4). For example, current photolithographic methods, such as ultra-violet (UV), are unsuitable for patterning the conducting polymers due to the involvement of wet and/or dry etching processes in these methods. In addition, current micro/nanosystems mainly have a planar form(5,6). One layer of structures is built on the top surfaces of another layer of fabricated features. Multiple layers of these structures are stacked together to form numerous devices on a common substrate. The sidewall surfaces of the microstructures have not been used in constructing devices. On the other hand, sidewall patterns could be used, for example, to build 3-D circuits, modify fluidic channels and direct horizontal growth of nanowires and nanotubes. A macropunching method has been applied in the manufacturing industry to create macropatterns in a sheet metal for over a hundred years. Motivated by this approach, we have developed a micropunching lithography method (MPL) to overcome the obstacles of patterning conducting polymers and generating sidewall patterns. Like the macropunching method, the MPL also includes two operations (Fig. 1): (i) cutting; and (ii) drawing. The "cutting" operation was applied to pattern three conducting polymers(4), polypyrrole (PPy), Poly(3,4-ethylenedioxythiophen)-poly(4-styrenesulphonate) (PEDOT) and polyaniline (PANI). It was also employed to create Al microstructures(7). The fabricated microstructures of conducting polymers have been used as humidity(8), chemical(8), and glucose sensors(9). Combined microstructures of Al and conducting polymers have been employed to fabricate capacitors and various heterojunctions(9,10,11). The "cutting" operation was also applied to generate submicron-patterns, such as 100- and 500-nm-wide PPy lines as well as 100-nm-wide Au wires. The "drawing" operation was employed for two applications: (i) produce Au sidewall patterns on high density polyethylene (HDPE) channels which could be used for building 3D microsystems(12,13,14), and (ii) fabricate polydimethylsiloxane (PDMS) micropillars on HDPE substrates to increase the contact angle of the channel(15).

Line-patterning of polyaniline coated MWCNT on stepped substrates using DC electric field

Ultrathin High-Mobility SWCNT Transistors with Electrodes Printed by Nanoporous Stamp Flexography

High-Resolution and Large-Area Patterning of Highly Conductive Silver Nanowire Electrodes by Reverse Offset Printing and Intense Pulsed Light Irradiation

Laser patterned polymer/nanotube composite electrodes for nanowire transistors on flexible substrates

Direct Fabrication of Micron-Thickness PVA-CNT Patterned Films by Integrating Micro-Pen Writing of PVA Films and Drop-on-Demand Printing of CNT Micropatterns

Fabrication of Shape‐Controlled Copper Line Arrays by Meniscus‐Confined 3D Microprinting on Insulating Substrates

Micropunching lithography for generating micro- and submicron-patterns on polymer substrates

Substrate-Versatile Direct-Write Printing of Carbon Nanotube-Based Flexible Conductors, Circuits, and Sensors

An Etching-Free Method for Patterning Carbon Nanotube Films Enabled by Universal Wettability Modulation

P‐14.2: Facile Patterning of Silver Nanowire with Invisible Effect for Naked Eyes via Ink‐jet Printing

Direct Patterning by Inkjet Printing 3-Mercaptopropionic Capped Nano Silver Suspension

Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES)

3.2: Facile Patterning of Silver Nanowire with Invisible Effect for Naked Eyes via Ink‐jet Printing

Printing of Nano‐ to Chip‐Scale Structures for Flexible Hybrid Electronics

Encapsulate-and-peel: fabricating carbon nanotube CMOS integrated circuits in a flexible ultra-thin plastic film

Continuous Patterning of Silver Nanowire-Polyvinylpyrrolidone Composite Transparent Conductive Film by a Roll-to-Roll Selective Calendering Process

Flexible Substrates Enabled Highly Integrated Patterns with Submicron Precision Toward Intrinsically Stretchable Circuits

Large Area Nanoscale Patterning of Functional Materials Using Organosilicate ink based Nanotransfer Printing

Printable Functional Chips Based on Nanoparticle Assembly.

Direct Printing of Ultrathin Block Copolymer Film with Nano‐in‐Micro Pattern Structures

Patterning Nanoparticles by Microcontact Printing and Further Growth of One-Dimensional Nanomaterials