Expansion force induced in-situ formation of 3D boron nitride network for light-weight, low-k, low-loss, and thermally conductive composites

Shiqing Zhou,Yanting Xu,Jiayue Tang,Kaijing Qian,Jun Zhao,Jun Wang,Hongwen Gao,Zhuo Li
DOI: https://doi.org/10.1039/d2ta02968e
IF: 11.9
2022-06-21
Journal of Materials Chemistry A
Abstract:Building an interconnected filler network is the most effective way for polymer composites to attain a high thermal conductivity while minimizing the amount of fillers. However, previous approaches for network construction either has to be performed ex situ or rely on magnetic or electrical fields to achieve in situ formation, limiting their practical applications. Here we report a novel strategy to fabricate filler network in situ without the assitance of any external fields. Thermally expandable microspheres (EMs) are added to the composite and their expansion at elevated temperature forces the conductive fillers to concentrate and align along the boundaries between adjacent microspheres, forming a continuous and densified 3D network. The obtained boron nitride nanosheets (BNNS)/EM/polydimethylsiloxane (PDMS) composite has a low density (0.55 g/cm3), low dielectronic constant (< 2.3), and excellent flexibility, while still exhibits a high thermal conductivity of 0.94 W m-1 K-1 (9.82 vol% BNNS), which is 3.1 times that of randomly distributed ones. In addition, it has a low interface thermal resistance (20.93 mm2 K W-1), only 1 % of the assembled structure. These comprehensive properties makes the composite ideal for thermal management of aerospace, high frequency electronic devices, and wearable electronics.
materials science, multidisciplinary,chemistry, physical,energy & fuels
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