Review of Power Electronics Components at Cryogenic Temperatures
Handong Gui,Ruirui Chen,Jiahao Niu,Zheyu Zhang,Leon M. Tolbert,Fei Fred Wang,Benjamin J. Blalock,Daniel Costinett,Benjamin B. Choi
DOI: https://doi.org/10.1109/tpel.2019.2944781
IF: 5.967
2020-05-01
IEEE Transactions on Power Electronics
Abstract:In order to apply power electronics systems to applications such as superconducting systems under cryogenic temperatures, it is necessary to investigate the characteristics of different parts in the power electronics system. This article reviews the influence of cryogenic temperature on power semiconductor devices including Si and wide bandgap switches, integrated circuits, passive components, interconnection and dielectric materials, and some typical cryogenic converter systems. Also, the basic theories and principles are given to explain the trends for different aspects of cryogenically cooled converters. Based on the review, Si active power devices, bulk Complementary metal-oxide-semiconductor (CMOS) based integrated circuits, nanocrystalline and amorphous magnetic cores, NP0 ceramic and film capacitors, thin/metal film and wirewound resistors are the components suitable for cryogenic operation. Pb-rich PbSn solder or In solder, classic printed circuit boards material, most insulation papers and epoxy encapsulant are good interconnection and dielectric parts for cryogenic temperatures.
engineering, electrical & electronic